Patents by Inventor Forest Hampton

Forest Hampton has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Universal solvent cement
    Publication number: 20060252865
    Abstract: A solvent cement for bonding PVC, CPVC and ABS plastic pipe and other molded articles comprises a minor amount of an acrylic resin and one or more solvents capable of dissolving the acrylic resin and further capable of dissolving at least the surfaces of PVC, CPVC and ABS molded articles, wherein the acrylic resin constitutes at least 75 wt. % of the dissolved thermoplastic resin in the cement.
    Type: Application
    Filed: May 6, 2005
    Publication date: November 9, 2006
    Inventors: Charles Bush, Forest Hampton, Amrit Parhar
  • Adhesive compositions and methods of using the same
    Publication number: 20060030689
    Abstract: Adhesive compositions are described which comprise at least one organic sulfoxide, sulfone or sulfide and at least one ketone, ether, ester, amide or carbonate or a mixture thereof. The adhesive compositions also may contain one or more water insoluble polymers such as ABS, PVC and CPVC. Methods of adhesively bonding or welding a first plastic surface to a second plastic surface using these adhesive compositions also are described.
    Type: Application
    Filed: April 12, 2005
    Publication date: February 9, 2006
    Inventors: Amrit Parhar, Forest Hampton, Charles Bush, Fred Scholer
  • Multi-layer structure and method for forming a thermal interface with low contact resistance between a microelectronic component package and heat sink
    Publication number: 20020148635
    Abstract: A multi-layer solid structure and method for forming a thermal interface between a microelectronic component package and a heat sink so that the structure has a total thermal resistance of no greater than about 0.03° C.-in2/W at a pressure of less than 100 psi. The structure comprises at least two metallic layers each of high thermal conductivity with one of the two layers having phase change properties for establishing low thermal resistance at the interface junction between the microelectronic component package and the heat sink.
    Type: Application
    Filed: March 1, 2002
    Publication date: October 17, 2002
    Applicant: THERMAGON INC.
    Inventors: Richard F. Hill, Forest Hampton