Patents by Inventor Forest Hampton, III

Forest Hampton, III has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Toilet sealing ring
    Patent number: 9163389
    Abstract: A toilet sealing ring for sealing the outlet of a floor mounted toilet to a mating drain pipe comprises an annular mass of a wax based composition comprising a wax component and at least 20 wt. % of a non-wax filler component.
    Type: Grant
    Filed: December 20, 2011
    Date of Patent: October 20, 2015
    Assignee: OATEY COMPANY
    Inventors: Raymond Toby Rael, Hayat El-Khoury, Amrit Parhar, Forest Hampton, III
  • Fast Curing CPVC Solvent Cement
    Publication number: 20140020828
    Abstract: A composition and method of using the composition are described. The composition is useful for quickly bonding chlorinated polyvinylchloride during installation and repair operations. Embodiments of the composition include at least one volatile organic solvent, chlorinated polyvinylchloride dissolved in the solvent and the composition is substantially free of cyclohexanone.
    Type: Application
    Filed: March 14, 2013
    Publication date: January 23, 2014
    Inventors: Amrit Kaur Parhar, Forest Hampton, III
  • TOILET SEALING RING
    Publication number: 20120174305
    Abstract: A toilet sealing ring for sealing the outlet of a floor mounted toilet to a mating drain pipe comprises an annular mass of a wax based composition comprising a wax component and at least 20 wt. % of a non-wax filler component.
    Type: Application
    Filed: December 20, 2011
    Publication date: July 12, 2012
    Applicant: OATEY COMPANY
    Inventors: Amrit Parhar, Forest Hampton, III, Raymond Toby Rael, Hayat El-Khoury
  • Universal solvent cement
    Patent number: 7592385
    Abstract: A solvent cement for bonding PVC, CPVC and ABS plastic pipe and other molded articles comprises a minor amount of an acrylic resin and one or more solvents capable of dissolving the acrylic resin and further capable of dissolving at least the surfaces of PVC, CPVC and ABS molded articles, wherein the acrylic resin constitutes at least 75 wt. % of the dissolved thermoplastic resin in the cement.
    Type: Grant
    Filed: May 6, 2005
    Date of Patent: September 22, 2009
    Assignee: Oatey Company
    Inventors: Charles N. Bush, Forest Hampton, III, Amrit Parhar
  • Adhesive compositions and methods of using the same
    Patent number: 7473753
    Abstract: Adhesive compositions are described which comprise at least one organic sulfoxide, sulfone or sulfide and at least one ketone, ether, ester, amide or carbonate or a mixture thereof. The adhesive compositions also may contain one or more water insoluble polymers such as ABS, PVC and CPVC. Methods of adhesively bonding or welding a first plastic surface to a second plastic surface using these adhesive compositions also are described.
    Type: Grant
    Filed: April 12, 2005
    Date of Patent: January 6, 2009
    Assignee: Oatey Co.
    Inventors: Amrit K. Parhar, Forest Hampton, III, Charles N. Bush, Fred R. Scholer
  • Multi-layer structure and method for forming a thermal interface with low contact resistance between a microelectronic component package and heat sink
    Patent number: 6761928
    Abstract: A multi-layer solid structure and method for forming a thermal interface between a microelectronic component package and a heat sink so that the structure has a total thermal resistance of no greater than about 0.03° C.-in2/W at a pressure of less than 100 psi. The structure comprises at least two metallic layers each of high thermal conductivity with one of the two layers having phase change properties for establishing low thermal resistance at the interface junction between the microelectronic component package and the heat sink.
    Type: Grant
    Filed: March 1, 2002
    Date of Patent: July 13, 2004
    Assignee: Thermagon, Inc.
    Inventors: Richard F. Hill, Forest Hampton, III
  • Multi-layer structure and method for forming a thermal interface with low contact resistance between a microelectronic component package and heat sink
    Patent number: 6372997
    Abstract: A multi-layer solid structure and method for forming a thermal interface between a microelectronic component package and a heat sink so that the structure has a total thermal resistance of no greater than about 0.03° C.-in2/W at a pressure of less than 100 psi. The structure comprises at least two metallic layers each of high thermal conductivity with one of the two layers having phase change properties for establishing low thermal resistance at the interface junction between the microelectronic component package and the heat sink.
    Type: Grant
    Filed: February 25, 2000
    Date of Patent: April 16, 2002
    Assignee: Thermagon, Inc.
    Inventors: Richard F. Hill, Forest Hampton, III