Patents by Inventor Formosa Epitaxy Incorporation

Formosa Epitaxy Incorporation has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130322072
    Abstract: The present invention relates to a light emitting apparatus comprising at least one light emitting device and a support mechanism. The light emitting device includes a transparent substrate which light can pass through; at least one LED chip emitting light omni-directionally is disposed on one surface of the substrate, and the light emitted by the LED chip will penetrate into the substrate and at least partially emerge from another surface of the substrate. The support mechanism is coupled to the light emitting device; a first angle is formed between the substrate and the support mechanism. According to the present invention, the light emitting apparatus using LED chips can provide sufficient lighting intensity and uniform lighting performance.
    Type: Application
    Filed: March 18, 2013
    Publication date: December 5, 2013
    Applicant: FORMOSA EPITAXY INCORPORATION
    Inventor: FORMOSA EPITAXY INCORPORATION
  • Publication number: 20130214693
    Abstract: A light emitting device including a light emitting component is provided, wherein said light emitting comprising an integrated light emitting diode and a semiconductor field effect transistor. The semiconductor field effect transistor may prevent situations such as overheating and voltage instability by controlling a current passing through the light emitting diode as well as enhancing the ability to withstand electrostatic discharge and reducing cost of the light emitting device in multiple aspects.
    Type: Application
    Filed: February 19, 2013
    Publication date: August 22, 2013
    Applicant: FORMOSA EPITAXY INCORPORATION
    Inventor: Formosa Epitaxy Incorporation
  • Publication number: 20130175572
    Abstract: A light-emitting diode (LED) chip comprising a first semiconductor layer; an active layer disposed on said first semiconductor layer; a second semiconductor layer disposed on said active layer; metal layers which disposed on said second semiconductor layer and overlapped with each other indirectly, comprising a first metal layer which connected to a first electrode deposited on said first semiconductor, and a second metal layer which connected to a transparent conductive layer and a second electrode deposited on said second semiconductor layer; wherein said second metal layer deposited on said first metal layer which further connected to said first semiconductor layer through an indentation.
    Type: Application
    Filed: December 14, 2012
    Publication date: July 11, 2013
    Applicant: FORMOSA EPITAXY INCORPORATION
    Inventor: FORMOSA EPITAXY INCORPORATION
  • Publication number: 20130099259
    Abstract: The present invention relates to a high-voltage light-emitting device suitable for light-emitting diode chip array module. The device comprises a set of light emitting diode chips, about 18-25 chips, deposited on a substrate by using a non-matrix arrangement. Through the adjustments, the high-voltage light-emitting device of the present invention has optimized luminous efficiency.
    Type: Application
    Filed: October 19, 2012
    Publication date: April 25, 2013
    Applicant: FORMOSA EPITAXY INCORPORATION
    Inventor: Formosa Epitaxy Incorporation