Abstract: A processor device for processing an incoming audio stream, the device including: a configuration element arranged to acquire input parameters having both first characteristics of the incoming audio stream and also second characteristics of the audio playback devices, and to produce configuration parameters on the basis of the input parameters; a master element arranged to define processing sequences from the configuration parameters, each processing sequence being associated with and adapted to a respective playback channel, to apply the processing sequences to the incoming audio stream so as to produce processed audio streams, each adapted to a respective one of the playback channels, and to transmit to each piece of equipment including an audio playback device the processed audio stream is adapted to the playback channel associated with the audio playback device.

Abstract: Disclosed is a method of guiding the pilot of an aircraft for the alignment maneuver, including: determining at a first instant an occurrence close to the alignment maneuver and triggering the display of a first symbol on the screen; updating the position of the first symbol on the horizon according to the updated value of the aircraft heading; when the alignment maneuver is to begin, moving a second symbol on the screen from the position of the first symbol, the direction of the displacement with respect to the horizon being determined depending on the direction of the crosswind with respect to the runway and the value of the displacement being determined depending on the difference between the current dynamic sideslip of the aircraft and a current dynamic sideslip setpoint value calculated for the aircraft.

Abstract: A conversion device for converting a guidance setpoint signal from an aircraft guidance system for at least one control axis, for example, into a control signal for an avionics system such as an aircraft stabilization system. The device may include comprising an acquisition module designed to acquire the guidance setpoint signal. The device may further include a generation module designed to generate the control signal from the acquired guidance setpoint signal. The control signal may include at least two command pulses. The generation module may be designed to calculate the duration between two consecutive command pulses depending on a corresponding value of the acquired guidance setpoint signal.

Abstract: A method for electrical connection by hybridisation of a first component with a second component. The method comprises the following steps: forming pads of ductile material in contact respectively with connection zones of the first component; forming inserts of conductive material in contact with the connection zones of the second component; forming hybridisation barriers arranged between the inserts and electrically insulated from each other, the first and second hybridisation barriers serving as a barrier by containing the deformation of the pads of ductile material during the connection of the connection zones of the first component with those of the second component. The disclosure also relates to an assembly of two connected components.

Abstract: A conversion device for converting a guidance setpoint signal from an aircraft guidance system for at least one control axis, into a control signal for an avionics system such as an aircraft stabilization system, comprising an acquisition module designed to acquire the guidance setpoint signal, and a generation module designed to generate the control signal from the acquired guidance setpoint signal, the control signal comprising at least two command pulses, the generation module being designed to calculate the duration between two consecutive command pulses depending on a corresponding value of the acquired guidance setpoint signal.

Abstract: A method of assembling a first and a second electronic components includes forming connection elements on an assembly surface of the first component and forming connection elements on an assembly surface of the second component. The method also includes depositing a liquid layer of electrically-insulating curable material on the assembly surface of the first and/or of the second component and arranging the first and second components on each other to place the connection elements of the second component in front of the connection elements of the first component. The method further includes applying a force along a predetermined direction and the first and/or the second components to create electric interconnects each formed of a connection element of the first component and of a connection element of the second component and curing the curable material.

Abstract: A method of assembling a first and a second electronic components includes forming connection elements on an assembly surface of the first component and forming connection elements on an assembly surface of the second component. The method also includes depositing a liquid layer of electrically-insulating curable material on the assembly surface of the first and/or of the second component and arranging the first and second components on each other to place the connection elements of the second component in front of the connection elements of the first component. The method further includes applying a force along a predetermined direction and the first and/or the second components to create electric interconnects each formed of a connection element of the first component and of a connection element of the second component and curing the curable material.