Abstract: An acoustic probe and a method for making the same. The probe includes a novel interconnection network consisting of two portions, i.e., a first portion in which M.times.N conductive paths have a section contacting M.times.N piezoelectric transducers and are arranged at a pitch (P.sub.N) in a direction (D.sub.x) and at a pitch (P.sub.M) in direction (D.sub.y) within the acoustic absorption material; and a second portion in which the M.times.N conductive paths are arranged on M dielectric substrates spaced apart at a pitch (P'.sub.M) and each provided with N paths are arranged at a pitch (P'.sub.N). A method for making the acoustic probe is also disclosed. The dielectric substrates may advantageously be flexible printed circuits optionally including chips.

Abstract: The disclosure relates to a mass memory with very large-scale integration as well as to a method for the manufacture of such a memory.

Abstract: A thermal detector with a monolithic structure comprises a layer of material sensitive to infrared radiation and an insulating layer constituted by a thermostable polymer that can be deposited as a thin layer and has a microporous structure. This insulating layer enables the thermal decoupling of the sensitive layer from the substrate comprising reading circuits with which the detector is provided. The performance characteristics of currently used monolithic infrared detectors can thus be substantially improved through the notable reduction of the thermal losses in the sensitive layer. This is achieved through the greatly reduced thermal conductivity of the layer of dielectric polymer. Application to infrared imaging devices.