Abstract: A method of producing a transponder (20) comprising the following steps: demarcating the various turns (8) of a coil in a sheet (1), including a dielectric substrate covered by at least one conducting layer (2), by stamping said conducting layer with a stamping die (5) having sharp-edged surfaces (6) for contact with the superficial conducting layer (2; 2"'), connecting at least one electronic component (25) to the turns (8), and mounting at least one protective sheet (22; 27) covering the coil and the electronic component (25). To facilitate the stamping and to obtain clean incisions, the conducting layer is covered, before stamping, with a synthetic film. To prevent short circuits over the incisions, the incisions are preferably filled in with an adhesive, varnish or lacquer.

Abstract: The present invention concerns a method of manufacture a method of manufacturing a card wherein there is supplied a compressible positioning structure (6), at least one electronic element (8) and a binder (12). The electronic element is positioned in a manner such that it is superposed onto the compressible positioning structure. In a first case, the binder (12) is supplied in liquid form. In another case, such binder is supplied in the form of a solid sheet, which is subsequently at least partially melted by applying energy. With the help of a press, pressure is applied to the various elements as supplied. The electronic element (8) then penetrates the positioning structure (6) and the binder spreads out so as to coat the electronic element (8). Finally there is obtained following solidification a solid card.