Patents by Inventor Fran.cedilla.ois Lamourelle

Fran.cedilla.ois Lamourelle has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Solder ball array package and a method of encapsulation
    Patent number: 6130383
    Abstract: A solder ball array package has a mould gate tape that is attached on top of a portion of the top surface of a leadless circuit carrying insulating substrate and on top of a portion of the top metallization pattern. The mould gate tape, which is optionally removable after completion of the moulding process, is such that it does not interfere with the design of the top side metallization pattern.
    Type: Grant
    Filed: May 24, 1996
    Date of Patent: October 10, 2000
    Assignee: SGS-Thomson Microelectronics, S.A.
    Inventor: Fran.cedilla.ois Lamourelle