Abstract: The card comprises an insulating support (1) supporting a winding (4) which is used as an antenna, and an integrated circuit (9) electrically connected to the ends (7, 8) of the winding. According to the invention, the support (1) comprises on a structured surface (2) a cavity (3) on the walls and the bottom of which the tracks of the winding (4) are found which are formed further on the structured surface. The cavity (3) also includes the ends (7, 8) of the winding and contains the integrated circuit (9) which is pressed against the tracks. The cavity (3) is furthermore filled up with a polymerized protection resin (14) and a layer of insulating material (15) covers the structured surface (2) to which it is bonded.

Abstract: In a first step, electrical conductor tracks (15 to 20) are applied against the bottom and the walls of a cavity (5) for the integrated circuit (IC4) and connected to external contact pads (2) at the same side of the card. Said tracks lie alternately side-by-side at the bottom 7 of the cavity. In a second step, the IC (4) is glued with its surface which does not carry the contacts on said tracks on the bottom (7) of the cavity by means of a non-conducting glue. Then connections are realized by soldering of conductor wires (12) between contacts of the IC and ends of the tracks, and the cavity is filled with a protective resin. Application: Placement of an IC with inverted contacts in an electronic card support.

Abstract: The electronic card comprises an electrically insulating card support provided with a cavity for accommodating an integrated circuit and, on one surface, with metal contact pads which are electrically connected to contacts of the integrated circuit. The invention comprises the steps of: (i) the application by an MID technique (Moulded Interconnection Devices) of electrical conductor tracks, all arranged on the bottom and the lateral walls of the cavity, and each connected to one of the metal contact pads arranged on the surface of the support which comprises the cavity, (ii) the realization of electrical connections connecting the contacts of the integrated circuit arranged in the cavity to the conductor tracks on the bottom of the cavity, and (iii) filling up of the cavity with a protective resin which is subsequently polymerized.