Patents by Inventor Fran.cedilla.ois Max d'Heurle

Fran.cedilla.ois Max d'Heurle has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5945737
    Abstract: A device having a thin film and/or a solder ball formed on a substrate. The thin film and the solder ball each include a metal and a compound that includes an oxide, nitride, or carbide precipitate of an expandable element or a contractible element. The compound is distributed in the metal to control the tensile and compressive stresses and mechanical properties of the thin film and the solder ball.
    Type: Grant
    Filed: November 6, 1997
    Date of Patent: August 31, 1999
    Assignee: International Business Machines Corporation
    Inventors: Cyril Cabral, Jr., Lawrence Alfred Clevenger, Fran.cedilla.ois Max d'Heurle, Qi-Zhong Hong
  • Patent number: 5834374
    Abstract: A method for forming thin films and controlling the tensile and compressive stresses and mechanical properties of the thin film. The method includes forming an alloy on a substrate having a solvent metal and a solute, then annealing the substrate and the alloy in one of an oxidizing, nitriding and carborizing ambient so that the ambient reacts with the solute to form respectively one of an oxide, nitride and carbide precipitates of the solute in the solvent. The solute is selected so that the precipitates formed may be used to control the mechanical properties of the solvent.
    Type: Grant
    Filed: May 1, 1995
    Date of Patent: November 10, 1998
    Assignee: International Business Machines Corporation
    Inventors: Cyril Cabral, Jr., Lawrence Alfred Clevenger, Fran.cedilla.ois Max d'Heurle, Qi-Zhong Hong