Abstract: A process for manufacturing a micro-fluidic device, the device including a substrate made of thermoplastic polymer having a face called the upper face and a first micro-fluidic circuit that includes at least one aperture that opens onto the upper face, and a component bearing pads arranged to become anchored in the substrate on the periphery of the aperture, the process including the following steps: heating so that the anchoring pads of the component reach a temperature at least equal to the glass-transition temperature of the substrate; fastening the component to the substrate by embedding then anchoring its pads in the substrate.

Abstract: The invention is a process for producing an electromechanical device including a movable portion that is able to deform with respect to a fixed portion. The process implements steps based on fabrication microtechnologies, applied to a substrate including an upper layer, an intermediate layer and a lower layer. These steps are: a) forming first apertures in the upper layer; b) forming an empty cavity in the intermediate layer, which step is referred to as a pre-release step because a central portion of the upper layer lying between the first apertures is pre-released; c) applying what is called a blocking layer to the upper layer, this layer covering the first apertures, the blocking layer and the central portion together forming a suspended microstructure above the empty cavity; d) producing a boundary trench in the suspended microstructure, so as to form, in this microstructure, a movable portion and a fixed portion, the movable portion forming a movable member of the electromechanical device.

Abstract: A method for producing at least one deformable membrane micropump including a first substrate and a second substrate assembled together, the first substrate including at least one cavity and the second substrate including at least one deformable membrane arranged facing the cavity. In the method: the cavity is produced in the first substrate; then the first and second substrates are assembled together; then the deformable membrane is produced in the second substrate.

Abstract: The invention is a process for producing an electromechanical device including a movable portion that is able to deform with respect to a fixed portion. The process implements steps based on fabrication microtechnologies, applied to a substrate including an upper layer, an intermediate layer and a lower layer. These steps are: a) forming first apertures in the upper layer; b) forming an empty cavity in the intermediate layer, which step is referred to as a pre-release step because a central portion of the upper layer lying between the first apertures is pre-released; c) applying what is called a blocking layer to the upper layer, this layer covering the first apertures, the blocking layer and the central portion together forming a suspended microstructure above the empty cavity; d) producing a boundary trench in the suspended microstructure, so as to form, in this microstructure, a movable portion and a fixed portion, the movable portion forming a movable member of the electromechanical device.

Abstract: The invention provides a device for the gravimetric detection of particles in a fluid medium, comprising a flat electromechanical oscillator (1), means for supporting the oscillator, means (15a, 15b, 15c, 15d) for actuating said oscillator and, on either side of the plane of the oscillator (1), two cavities (3, 5) enabling the oscillator (1) to vibrate when it is activated by the actuation means (15a, 15b, 15c, 15d), characterized in that at least one of the two cavities (3, 5) forms an integral part of a channel (2, 4) for the passage of a fluid over at least one of the faces (1a, 1b) of the oscillator and in that said actuation means (15a, 15b, 15c, 15d) take the form of at least one electrode (15a, 15b, 15c, 15d) lying in the same plane as that of the electromechanical oscillator and at a defined distance (g) from the oscillator, so as to ensure that the oscillator vibrates in its plane.

Abstract: An electronic device with integrated discrete components, including a wafer including cavities that can receive the components, an active face of the components being in a same plane as a face of the receiving wafer, and a material for laterally coating the components in the cavities.

Abstract: A method for producing at least one deformable membrane micropump including a first substrate and a second substrate assembled together, the first substrate including at least one cavity and the second substrate including at least one deformable membrane arranged facing the cavity. In the method: the cavity is produced in the first substrate; then the first and second substrates are assembled together; then the deformable membrane is produced in the second substrate.

Abstract: A method of producing an electronic connection device, including: a) formation, in a plane of a support substrate, of at least one first contact element and, in a direction approximately perpendicular to the plane, of at least one second contact element having a first end in electrical contact with the first contact element or elements and a second end, the second contact element or elements including one or more metal tracks standing up along the direction perpendicular to the surface of the substrate; b) then positioning at least one electrical or electronic component in contact with the first contact element or elements; and c) encapsulation of the component(s) and of the first and second contact elements, at least the second end or ends of the second contact element or elements being flush with the surface of the encapsulating material.

Abstract: A method for installing a sorption element in a cavity including: disposing, within the cavity, a getter material, a reaction material, and a protective material, the protective material covering at least one part of the getter material so as to bury the at least one part; raising a temperature up to at least one removal temperature; and moving the protective material towards the reaction material by reaction between the protective material and the reaction material so that at least one portion of the part of the getter material is no longer covered with the protective material.

Abstract: A reconstituted electronic device including: a first face and a second face; a plurality of individual chips placed perpendicular to the faces, each individual chip carrying, on one of its surfaces, at least one component, tracks, and a connection mechanism that are flush with one or other of the faces of the reconstituted electronic device; and an encapsulant that encapsulates the individual chips.

Abstract: The invention provides a device for the gravimetric detection of particles in a fluid medium, comprising a flat electromechanical oscillator (1), means for supporting the oscillator, means (15a, 15b, 15c, 15d) for actuating said oscillator and, on either side of the plane of the oscillator (1), two cavities (3, 5) enabling the oscillator (1) to vibrate when it is activated by the actuation means (15a, 15b, 15c, 15d), characterized in that at least one of the two cavities (3, 5) forms an integral part of a channel (2, 4) for the passage of a fluid over at least one of the faces (1a, 1b) of the oscillator and in that said actuation means (15a, 15b, 15c, 15d) take the form of at least one electrode (15a, 15b, 15c, 15d) lying in the same plane as that of the electromechanical oscillator and at a defined distance (g) from the oscillator, so as to ensure that the oscillator vibrates in its plane.

Abstract: The invention relates to an encapsulated microcomponent having a cover (3) delimiting a sealed cavity (4) equipped with at least one orifice (5) provided with a plug (6). The plug (6) comprises a getter material portion (6.1) exposed inside the cavity (4). Application in particular in MEMS.

Abstract: An electronic device with integrated discrete components, including a wafer including cavities that can receive the components, an active face of the components being in a same plane as a face of the receiving wafer, and a material for laterally coating the components in the cavities. The invention relates to an electronic device with integrated discrete components (4), including: a wafer (2), a so-called receiving wafer, said wafer having cavities (5, 5?) containing said components, the active face (10) of which is in a same plane as a face (8) of the receiving wafer, a material (6) for laterally coating the components in the cavities.

Abstract: A reconstituted electronic device including: a first face and a second face; a plurality of individual chips placed perpendicular to the faces, each individual chip carrying, on one of its surfaces, at least one component, tracks, and a connection mechanism that are flush with one or other of the faces of the reconstituted electronic device; and an encapsulant that encapsulates the individual chips.

Abstract: A method of producing an electronic connection device, including: a) formation, in a plane of a support substrate, of at least one first contact element and, in a direction approximately perpendicular to the plane, of at least one second contact element having a first end in electrical contact with the first contact element or elements and a second end, the second contact element or elements including one or more metal tracks standing up along the direction perpendicular to the surface of the substrate; b) then positioning at least one electrical or electronic component in contact with the first contact element or elements; and c) encapsulation of the component(s) and of the first and second contact elements, at least the second end or ends of the second contact element or elements being flush with the surface of the encapsulating material.

Abstract: This assembly of an object and a support is achieved by using solder bumps. At least two wettability areas are made respectively on an object and on a support. Each solder bump ensures electrical contact and mechanical fixing firstly to one of the wettability areas of object and secondly to one of the wettability areas of support. The melting temperature of solder bumps is lower than the melting temperature of each of the wettability areas. Each wettability area of the object forms an angle of 70° to 110° with respect to each wettability area of the support and the object and the support are mutually distant from one another.

Abstract: The invention relates to a method of maintaining the optimal properties of a thin film getter (10) in a cavity (8) of a microelectronic device (1), consisting in coating the getter film (10) with a protective film (12) and installing a reaction element (14). According to the invention, an increase in temperature, while the cavity (8) may be placed under vacuum, causes the protective film (12) to react with the reaction element (14), such that the protective material (12) moves towards the reaction element (14) and releases the getter film of getter material (10).

Abstract: The invention relates to an encapsulated microcomponent having a cover (3) delimiting a sealed cavity (4) equipped with at least one orifice (5) provided with a plug (6). The plug (6) comprises a getter material portion (6.1) exposed inside the cavity (4). Application in particular in MEMS.

Abstract: The invention relates to a frequency filter including a structure with, on one face, two extreme evanescent areas and at least one wave guide area between the evanescent areas. The at least one wave guide area and the evanescent areas form a single closed cavity. The single cavity is partitioned by at least two resonator elements that are embedded in the single cavity at placement areas and that contribute to delimiting the at least one wave guide area and the evanescent areas.

Abstract: This assembly of an object and a support is achieved by using solder bumps. At least two wettability areas are made respectively on object and on support. Each solder bump ensures electrical contact and mechanical fixing firstly to one of the wettability areas of object and secondly to one of the wettability areas of support. The melting temperature of solder bumps is lower than the melting temperature of each of the wettability areas. Each wettability area of object forms an angle of 70° to 110° with respect to each wettability area of support. Object and support are mutually distant.