Abstract: A method is disclosed for securing an optical fiber to a packaging substrate with a bismuth-containing alloy of solder. For this purpose, the substrate may be provided with metallic pads or a blanket metallization to which the alloy or solder can adhere and the optical fiber is then positioned above such substrate and bonded to it with the alloy or solder. Also, a cavity or recess may be formed in the substrate in which the optical fiber is positioned and into which the alloy or solder is delivered in preformed or liquid state and is solidified in the cavity or recess while bonding the fiber. An optical assembly is also disclosed in which at least one optical fiber is bonded to the substrate by means of the bismuth-containing alloy or solder.

Abstract: A method is disclosed for securing an optical fiber to a packaging substrate with a bismuth-containing alloy of solder. For this purpose, the substrate may be provided with metallic pads or a blanket metallization to which the alloy or solder can adhere and the optical fiber is then positioned above such substrate and bonded to it with the alloy or solder. Also, a cavity or recess may be formed in the substrate in which the optical fiber is positioned and into which the alloy or solder is delivered in preformed or liquid state and is solidified in the cavity or recess while bonding the fiber. An optical assembly is also disclosed in which at least one optical fiber is bonded to the substrate by means of the bismuth-containing alloy or solder.