Abstract: A method for sharing manufacturing data on a product includes a step of receiving data on the manufacturing state of the product, a step of generating new data on the manufacturing state of the product, and a step of transmitting the new state data to at least two RFID tags.

Abstract: An inductor assembly for use in RF and microwave circuits wherein the inductor is formed of a first spiral wound metal strip that is mounted on a flat surface of a quartz substrate. A metal strip is formed of copper and has a height above the flat surface that is about 30 microns.

Abstract: The invention concerns an electronic microcomponent, produced from a semiconductor substrate wafer (1), comprising two parts, namely a fixed part (10) and a mobile part (11) capable of mutual relative displacement.

Abstract: A monolithic integrated circuit (1) incorporating an inductive component (2) and comprising: a semiconductor substrate layer (2); a passivation layer (4) covering the substrate layer (2); metal contact pads (5) connected to the substrate (2) and passing through the passivation layer (4) in order to be flush with the upper face (6) of the passivation layer (4); which circuit also includes a spiral winding (20) which forms an inductor and lies in a plane parallel to the upper face (6) of the passivation layer (4), said winding (20) consisting of copper turns (21-23, 27, 28) having a thickness of greater than 10 microns, the winding ends forming extensions (12) which extend below the plane of the winding (20) and are connected to the contact pads (5).

Abstract: An inductive component (1), especially intended to be incorporated into a radiofrequency circuit, comprising:

Abstract: A monolithic integrated circuit (1) incorporating an inductive component (2) and comprising:

Abstract: A monolithic integrated circuit (1) incorporating an inductive component (2) and comprising: a semiconductor substrate layer (2); a passivation layer (4) covering the substrate layer (2); metal contact pads (5) connected to the substrate (2) and passing through the passivation layer (4) in order to be flush with the upper face (6) of the passivation layer (4); which circuit also includes a spiral winding (20) which forms an inductor and lies in a plane parallel to the upper face (6) of the passivation layer (4), said winding (20) consisting of copper turns (21-23, 27, 28) having a thickness of greater than 10 microns, the winding ends forming extensions (12) which extend below the plane of the winding (20) and are connected to the contact pads (5).

Abstract: An inductor assembly for use in RF and microwave circuits wherein the inductor is formed of a first spiral wound metal strip that is mounted on a flat surface of a quartz substrate. The metal strip is formed of copper and has a height above the flat surface that is about 30 microns.

Abstract: Process for fabricating electronic components, of the variable capacitor or microswitch type, comprising a fixed plate (1) and a deformable membrane (20) which are located opposite each other, which comprises the following steps, consisting in:

Abstract: Process for fabricating electronic components, of the variable capacitor or microswitch type, comprising a fixed plate (1) and a deformable membrane (20) which are located opposite each other, which comprises the following steps, consisting in: depositing a first metal layer on an oxide layer (2), said first metal layer being intended to form the fixed plate; depositing a metal ribbon (10, 11) on at least part of the periphery and on each side of the fixed plate (1), said ribbon being intended to serve as a spacer between the fixed plate (1) and the deformable membrane (20); depositing a sacrificial resin layer (15) over at least the area of said fixed plate (1); generating, by lithography, a plurality of wells in the surface of said sacrificial resin layer; depositing, by electrolysis, inside the wells formed in the sacrificial resin (15), at least one metal region intended to form the deformable membrane (20), this metal region extending between sections of the metal ribbon (10, 11) which are located o

Abstract: Apparatus and Method relating to a microcomponent such as an inductor in which copper segments are mounted in parallel channels of a non-conductive substrate so that the top surfaces of the segments are coplanar with the top surface of the substrate. A core material is placed over the top surface of the substrate and conductive arches are arranged to connect one end of each segment with the opposite end of an adjacent segment to form a coil that encircles the core.

Abstract: The present invention relates to a blade with a swept-back tip for the rotary wings of an aircraft, particularly a helicopter, said blade (1) being formed from successive elementary cross sections. According to the invention, with said blade (1) being subdivided into various zones, the chord length L and the offset Y′f of the aerodynamic center with respect to the feathering axis (OX), as well as the relative thickness of each elementary section, are optimized for flight within a moderate speed range.

Abstract: Process for fabricating electronic components, of the variable capacitor or microswitch type, comprising a fixed plate (1) and a deformable membrane (20) which are located opposite each other, which comprises the following steps, consisting in: