Abstract: An audiometric headset having a transducer mounting and sound insulation system which closely couples the transducer to the ear. The headset is comprised of a pair of domes having a soft foam liner and soft sponge sound-absorbent material surrounding a floating sound transducer mounted in an open side of the case. The sound transducer is mounted in a socket of a circular resilient hub supported on a resilient flange by a pair of resilient strips providing a semi-circular opening between the interior of the case and the exterior of the earpiece. The resilient flange provides a channel for mounting on a rim around the periphery of the opening in the dome or case. An ear cushion snap-locked into a channel surrounding the socket supporting the transducer closely couples the transducer to the ear. A resilient earmuff is mounted around the rim of the case opening and is filled with a sound-filtering soft material whereby the muff seals around the ear to eliminate external ambient noise.