Abstract: A method of fabricating a device, comprising forming portions of electronic circuitry and a shadow wall structure over a substrate, and subsequently depositing a conducting layer over the substrate by angled deposition of a conducting material in at least a first deposition direction at an acute angle relative to the plane of the substrate. The shadow wall structure is arranged to cast a shadow in the deposition, leaving areas where the conducting material is not deposited. The shadow wall structure comprises one or more gaps each shorter than a shadow length of a respective part of the shadow wall structure casting the shadow into the gap, to prevent the conducting material forming in the gaps and to thereby create regions of said upper conducting layer that are electrically isolated from one another. These are arranged to form conducting elements for applying signals to, and/or receiving signals from, the electronic circuitry.

Abstract: A method of fabricating a device, comprising forming portions of electronic circuitry and a shadow wall structure over a substrate, and subsequently depositing a conducting layer over the substrate by angled deposition of a conducting material in at least a first deposition direction at an acute angle relative to the plane of the substrate. The shadow wall structure is arranged to cast a shadow in the deposition, leaving areas where the conducting material is not deposited. The shadow wall structure comprises one or more gaps each shorter than a shadow length of a respective part of the shadow wall structure casting the shadow into the gap, to prevent the conducting material forming in the gaps and to thereby create regions of said upper conducting layer that are electrically isolated from one another. These are arranged to form conducting elements for applying signals to, and/or receiving signals from, the electronic circuitry.