Patents by Inventor Francesco D'Aragona

Francesco D'Aragona has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Direct wafer bonded structure method of making
    Patent number: 5413952
    Abstract: A method for forming a direct wafer bonded structure having a buried high temperature metal nitride layer (16) and improved thermal conductivity is provided. By patterning the high temperature metal nitride layer (16) with a non-oxidizing photoresist stripper and absent a photoresist hardening step, adhesion between the high temperature metal nitride layer (16) and a dielectric layer (17, 27) subsequently formed over the high temperature metal nitride layer (16) is significantly improved. The dielectric layer (17, 27) will adhere to the high temperature metal nitride layer (16) in high temperature environments. In addition, a direct wafer bonded structure having a buried high temperature metal nitride layer (16) and improved thermal conductivity is provided. The structure is suitable for power, logic, and high frequency integrated circuit devices.
    Type: Grant
    Filed: February 2, 1994
    Date of Patent: May 9, 1995
    Assignee: Motorola, Inc.
    Inventors: Irenee Pages, Francesco D'Aragona, James A. Sellers, Raymond C. Wells