Abstract: The present invention is an interposer for electrically coupling a microcard with a mother board. The interposer includes a frame which is interposed between the microcard and the motherboard, electrically connecting the microcard and the motherboard by means of plated via-holes. The substrate is organic and a plurality of chips are mounted on both sides of the substrate. On the opposite sides of the interposer are pluralities of metal pads which are coupled by metallized via holes, the pads in turn connected to the chips, thereby coupling chips or cards on one side of the interposer to chips or boards on the other side. Electrical connection between the chips on the top side of the substrate and the metal pads on the lower side of the substrate is provided by the metallized via holes.

Abstract: The present invention is an interposer for electrically coupling a microcard with a mother board. The interposer includes a frame which is interposed between the microcard and the motherboard, electrically connecting the microcard and the motherboard by means of plated via-holes. The substrate is organic and a plurality of chips are mounted on both sides of the substrate. On the opposite sides of the interposer are pluralities of metal pads which are coupled by metallized via holes, the pads in turn connected to the chips, thereby coupling chips or cards on one side of the interposer to chips or boards on the other side. Electrical connection between the chips on the top side of the substrate and the metal pads on the lower side of the substrate is provided by the metallized via holes.

Abstract: In the manufacturing process of electronic modules a problem could arise when the modules have non-flat top surface. This is due to the fact that most of the automatic picking tools uses a vacuum nozzle to pick and place the module. According to the present invention a flat feature (a cap or a stud) is added to the module. This flat feature can be either fixed on the module or removable after the manufacture in order to reduce the dimensions.

Abstract: An electronic package (400), particularly a BGA, including a circuitized substrate (120) and one or more active devices (110) attached thereon by means of corresponding conductive pads provided on a surface of the substrate (120); each conductive pad is splitted in a plurality of parts (212-218) not in contact. Such parts (212-218) may be separated by a wireable area of the substrate (120), thereby providing one or more wiring channels. In addition, the same parts (212-218) may be connected in interfacing couples at different electrical potentials (ground and power) and decoupled to each other by means of capacitors (410); the connections to the ground and power are achieved by metallized holes provided through the substrate (120).