Abstract: A method for bidirectional optical communication comprising the steps of:—at a first optical line terminal, directly modulating a laser source to generate a downstream optical signal which has an optical power spectrum comprising two peaks having a frequency separation and a non zero power difference at generation;—propagating said downstream optical signal at a distance along an optical line comprising at least a first optical fiber propagating said downstream optical signal to a second optical line terminal;—at the second optical line terminal: power splitting said downstream optical signal to generate a first and a second power portion of said downstream optical signal, spatially separated; passive filtering said first power portion of said downstream optical signal so as to increase in absolute value a respective power difference of said two peaks, so as to obtain a filtered optical signal which is thereafter detected; and amplitude modulating the second power portion of the downstream optical signal so a

Abstract: A method of protecting from over-temperature a device associated with an electronic converter including a feedback path for regulating the output signal of said electronic converter may include providing a thermal sensitive component sensitive to the temperature of said device, and including said thermal sensitive component in said feedback path of said electronic converter, whereby said output signal of said electronic converter is reduced as a function of the temperature of said device as sensed by said thermal sensitive component.

Abstract: A power converter is provided, which may include_a transformer having primary and secondary windings; a primary side switching bridge arrangement including at least two switches switcheable at a switching frequency to drive the primary winding of said transformer, said primary side switching bridge arrangement including at least one decoupling capacitor; and a secondary side rectifying and filtering stage coupled to the secondary winding of said transformer, wherein said secondary side rectifying and filtering stage includes a current doubler with at least one inductor, wherein said at least one decoupling capacitor and said at least one inductor in said current doubler comprise a resonant tank circuit having a resonant frequency range encompassing said switching frequency, whereby said converter exhibits a gain defined by the position of said switching frequency within said resonant frequency range.

Abstract: A lighting device (100) including light radiation sources that can be mixed (102) to produce multi-chromatic light radiation (W; W1, W2, W3, W4; WS) as an additive mixture of the radiations generated by said sources, comprising a plurality of sets (1, 1?; 2, 2?; 3, 3?; 1, 2, 3; 1?, 2?, 3?; 1, 1?; 2, 2?; 3, 3?; 4, 4?; 1, 2, 3, 4, 5, 6) of light radiation sources, wherein each set includes light radiation sources that can be mixed (102) to produce multi-chromatic light radiation through additive mixing of the radiations generated by the sources in the set; and a control device (10, 10?, 1000) to selectively activate the sets (1, 1?; 2, 2?; 3, 3?; 1, 2, 3; 1?, 2?, 3?; 1, 1?; 2, 2?; 3, 3?; 4, 4?; 1, 2, 3, 4, 5, 6) of radiation sources in said plurality

Abstract: The invention relates to a process for manufacturing an integrated optical device. The method involves forming a silicon dioxide multilayer structure on a silicon substrate containing, in a first region a core layer of a waveguide of the optical device. The core includes an electromagnetic radiation inlet/outlet A trench in a second region of the multilayer structure adjacent said first region is formed by a an anisotropic etching, the trench including side walls and a bottom wall spaced from the Substrate.

Abstract: A method of protecting from over-temperature a device associated with an electronic converter including a feedback path for regulating the output signal of said electronic converter may include providing a thermal sensitive component sensitive to the temperature of said device, and including said thermal sensitive component in said feedback path of said electronic converter, whereby said output signal of said electronic converter is reduced as a function of the temperature of said device as sensed by said thermal sensitive component.

Abstract: A power converter is provided, which may include_a transformer having primary and secondary windings; a primary side switching bridge arrangement including at least two switches switcheable at a switching frequency to drive the primary winding of said transformer, said primary side switching bridge arrangement including at least one decoupling capacitor; and a secondary side rectifying and filtering stage coupled to the secondary winding of said transformer, wherein said secondary side rectifying and filtering stage includes a current doubler with at least one inductor, wherein said at least one decoupling capacitor and said at least one inductor in said current doubler comprise a resonant tank circuit having a resonant frequency range encompassing said switching frequency, whereby said converter exhibits a gain defined by the position of said switching frequency within said resonant frequency range.

Abstract: A process for manufacturing an integrated device includes the steps of: providing a silicon substrate on which a silicon dioxide structure is arranged and forming a trench having first and second essentially vertical walls relative to the substrate in the structure by means of anisotropic-type etching. A concavity having a sloped wall relative to the substrate is formed by isotropic-type etching which removes the second wall so that the concavity is open to the trench and the sloped wall faces the first wall.

Abstract: A coupling structure for coupling optical radiation, i.e., light, between an optical fibre and an optical device, e.g., a laser diode or a photodiode. The coupling structure has an optical through-via which guides the optical radiation to or from the optical fibre. Light exiting the fibre travels through a guidance channel so it remains substantially confined to a narrow optical path that mimics the fibre core. Conversely, light enters the fibre after having traveled through the guidance channel. The guidance channel has a first core region, the “channel core”, having first refractive index surrounded by a second region, the “channel cladding” having a second refractive index smaller than the first refractive index. The coupling structure, including the guidance channel, is preferably made of semiconductor-based material, more preferably of silicon-based material. The guidance channel is preferably silicon oxide.

Abstract: The invention relates to a process for manufacturing an integrated optical device. The method involves forming a silicon dioxide multilayer structure on a silicon substrate containing, in a first region a core layer of a waveguide of the optical device. The core includes an electromagnetic radiation inlet/outlet A trench in a second region of the multilayer structure adjacent said first region is formed by a an anisotropic etching, the trench including side walls and a bottom wall spaced from the Substrate.

Abstract: A coupling structure for coupling optical radiation, i.e., light, between an optical fibre and an optical device, e.g., a laser diode or a photodiode. The coupling structure has an optical through-via which guides the optical radiation to or from the optical fibre. Light exiting the fibre travels through a guidance channel so it remains substantially confined to a narrow optical path that mimics the fibre core. Conversely, light enters the fibre after having traveled through the guidance channel. The guidance channel has a first core region, the “channel core”, having first refractive index surrounded by a second region, the “channel cladding” having a second refractive index smaller than the first refractive index. The coupling structure, including the guidance channel, is preferably made of semiconductor-based material, more preferably of silicon-based material. The guidance channel is preferably silicon oxide.

Abstract: A process for manufacturing an integrated device includes the steps of: providing a silicon substrate on which a silicon dioxide structure is arranged; and forming a trench having first and second essentially vertical walls relative to the substrate in the structure by means of anisotropic-type etching. A concavity having a sloped wall relative to the substrate is formed by isotropic-type etching which removes the second wall so that the concavity is open to the trench and the sloped wall faces the first wall.

Abstract: An optoelectronic module includes a first sub-module and a second sub-module. The first sub-module has a surface with a cavity formed therein, and includes an integrated waveguide provided with a first optical port accessible from the cavity. The second sub-module faces the first sub-module. A metallic wall extends from the first sub-module to the second sub-module, and surrounds the cavity to define a hermetically closed chamber. An optoelectronic device is coupled to at least one of the first and second sub-modules, and is included in the chamber. The optoelectronic may comprise a second optical port coupled to the first optical port in the first sub-module.

Abstract: A packaging structure for optoelectronic components is formed by a first body, of semiconductor material, and a second body, of semiconductor material, fixed to a first face of said first body. A through window is formed in the second body and exposes a portion of the first face of the first body, whereon at least one optoelectronic component is fixed. Through connection regions extend through the first body and are in electrical contact with the optoelectronic component. The through connection regions are insulated from the rest of the first body via through insulation regions. Contact regions are arranged on the bottom face of the first body and are connected to said optoelectronic component via the through connection regions.

Abstract: A packaging structure for optoelectronic components is formed by a first body, of semiconductor material, and a second body, of semiconductor material, fixed to a first face of said first body. A through window is formed in the second body and exposes a portion of the first face of the first body, whereon at least one optoelectronic component is fixed. Through connection regions extend through the first body and are in electrical contact with the optoelectronic component. The through connection regions are insulated from the rest of the first body via through insulation regions. Contact regions are arranged on the bottom face of the first body and are connected to said optoelectronic component via the through connection regions.

Abstract: Laminated sheet material 9 comprises a laminate of a polyvinyl alcohol or other water-disintegratable film 12 with a thin coextruded film comprising a melt-bondable layer 15 and an impermeable layer 14. The laminate is odor impermeable but water disposable and so can be used to form a toilet-disposable ostomy bag by melt-sealing around the edges 10 between the facing melt-sealable surfaces 15.

Abstract: The film is formed by a composition comprising a mixture of 50-100 weight % of an ethylene-butyl-acrylate copolymer (EBA) having a content of butyl-acrylate (BA) of 5-50 weight %, and 0-50 weight % of an elastomeric polyolefin. Laminates comprising a layer constituted by said film have excellent characteristics of noiselessness and softness.

Abstract: Laminated sheet material 9 comprises a laminate of a polyvinyl alcohol or other water-disintegratable film 12 with a thin coextruded film comprising a melt-bondable layer 15 and an impermeable layer 14. The laminate is odor impermeable but water disposable and so can be used to form a toilet-disposable ostomy bag by melt-sealing around the edges 10 between the facing melt-sealable surfaces 15.

Abstract: HB polymers, such as copolymers of hydroxy butyric acid and hydroxy valeric acid, are provided as melt extruded films having a thickness of 5 to 200 .mu.m. Sheet materials may consist of such a film or the film may be laminated with other films to increase strength or impermeability. The films are best made by co-extrusion with a thermoplastic that is substantially non-tacky upon solidification. The sheet materials are of particular value as diaper backsheets and ostomy bags. They may include a layer of non-woven material.

Abstract: HB polymers, such as copolymers of hydroxy butyric acid and hydroxy valeric acid, are provided as melt extruded films having a thickness of 5 to 200 .mu.m. Sheet materials may consist of such a film or the film may be laminated with other films to increase strength or impermeability. The films are best made by co-extrusion with a thermoplastic that is substantially non-tacky upon solidification. The sheet materials are of particular value as diaper backsheets and ostomy bags. They may include a layer of non-woven material.