Abstract: The manufacture process includes: forming a first wafer of semiconductor material housing integrated electronic components forming a microactuator control circuit and a signal preamplification circuit; forming microactuators, each including a rotor and a stator, in a surface portion of a second wafer of semiconductor material; attaching the second wafer to the first wafer, with the surface portion of the second wafer facing the first wafer; thinning the second wafer; attaching the second wafer to a third wafer to obtain a composite wafer; thinning the first wafer; cutting the composite wafer into a plurality of dice connected to a protection chip; removing the protection chip; attaching read/write transducers to the dice; and attaching the dice to supporting blocks for hard-disk drivers.

Abstract: The microstructure, of semiconductor material, includes a micromotor and an encapsulation structure. The micromotor is externally delimited by a first and a second faces, opposed to one another, and by a side delimitation trench. The encapsulation structure surrounds the micromotor and has a bottom portion facing the second face of the micromotor, and an outer lateral portion facing the side delimitation trench. An outer separation trench extends through the bottom portion of the encapsulation structure, separates a mobile region from the external side portion, and defines, together with the side delimitation trench, a labyrinthic path for contaminating particles. A sealing ring extends on the bottom portion of the encapsulation structure around an inner separation trench separating the mobile region from a fixed central region and closes a gap between the bottom portion and a mobile component connected to the mobile region of the encapsulation structure.

Abstract: The microstructure, of semiconductor material, includes a micromotor and an encapsulation structure. The micromotor is externally delimited by a first and a second faces, opposed to one another, and by a side delimitation trench. The encapsulation structure surrounds the micromotor and has a bottom portion facing the second face of the micromotor, and an outer lateral portion facing the side delimitation trench. An outer separation trench extends through the bottom portion of the encapsulation structure, separates a mobile region from the external side portion, and defines, together with the side delimitation trench, a labyrinthic path for contaminating particles. A sealing ring extends on the bottom portion of the encapsulation structure around an inner separation trench separating the mobile region from a fixed central region and closes a gap between the bottom portion and a mobile component connected to the mobile region of the encapsulation structure.