Patents by Inventor Francesco Salamone

Francesco Salamone has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220108939
    Abstract: A blocking element is provided for connecting an electronic, micro-mechanical and/or micro-electro-mechanical component, in particular for controlling the propulsion of an electric vehicle. The pin blocking element is formed by a holed body having a first end, a second end and an axial cavity configured for fittingly accommodating a connecting pin. A first flange projects transversely from the holed body at the first end and a second flange projects transversely from the holed body at the second end. The first flange has a greater area than the second flange and is configured to be ultrasonically soldered to a conductive bearing plate to form a power module.
    Type: Application
    Filed: September 30, 2021
    Publication date: April 7, 2022
    Applicant: STMicroelectronics S.r.l.
    Inventors: Agatino MINOTTI, Francesco SALAMONE, Massimiliano FIORITO, Alessio SCORDIA, Manuel PONTURO
  • Patent number: 11239132
    Abstract: A semiconductor power device has: a die, with a front surface and a rear surface, and with an arrangement of projecting regions on the front surface, which define between them windows arranged within which are contact regions; and a package, which houses the die inside it. A metal frame has a top surface and a bottom surface; the die is carried by the frame on the top surface; an encapsulation coating coats the frame and the die. A first insulation multilayer is arranged above the die and is formed by an upper metal layer, a lower metal layer, and an intermediate insulating layer; the lower metal layer is shaped according to an arrangement of the projecting regions and has contact projections, which extend so as to electrically contact the contact regions, and insulation regions, interposed between the contact projections, in positions corresponding to the projecting regions.
    Type: Grant
    Filed: June 5, 2020
    Date of Patent: February 1, 2022
    Assignee: STMICROELECTRONICS S.R.L.
    Inventors: Francesco Salamone, Cristiano Gianluca Stella
  • Publication number: 20210327792
    Abstract: A power device for surface mounting has a leadframe including a die-attach support and at least one first lead and one second lead. A die, of semiconductor material, is bonded to the die-attach support, and a package, of insulating material and parallelepipedal shape, surrounds the die and at least in part the die-attach support and has a package height. The first and second leads have outer portions extending outside the package, from two opposite lateral surfaces of the package. The outer portions of the leads have lead heights greater than the package height, extend throughout the height of the package, and have respective portions projecting from the first base.
    Type: Application
    Filed: April 9, 2021
    Publication date: October 21, 2021
    Applicant: STMicroelectronics S.r.l.
    Inventors: Cristiano Gianluca STELLA, Fabio Vito COPPONE, Francesco SALAMONE
  • Publication number: 20210037674
    Abstract: The device has a first support element forming a first thermal dissipation surface and carrying a first power component; a second support element forming a second thermal dissipation surface and carrying a second power component, a first contacting element superimposed to the first power component; a second contacting element superimposed to the second power component; a plurality of leads electrically coupled with the power components through the first and/or the second support elements; and a thermally conductive body arranged between the first and the second contacting elements. The first and the second support elements and the first and the second contacting elements are formed by electrically insulating and thermally conductive multilayers.
    Type: Application
    Filed: July 21, 2020
    Publication date: February 4, 2021
    Inventors: Cristiano Gianluca STELLA, Francesco SALAMONE
  • Publication number: 20200303278
    Abstract: A semiconductor power device has: a die, with a front surface and a rear surface, and with an arrangement of projecting regions on the front surface, which define between them windows arranged within which are contact regions; and a package, which houses the die inside it. A metal frame has a top surface and a bottom surface; the die is carried by the frame on the top surface; an encapsulation coating coats the frame and the die. A first insulation multilayer is arranged above the die and is formed by an upper metal layer, a lower metal layer, and an intermediate insulating layer; the lower metal layer is shaped according to an arrangement of the projecting regions and has contact projections, which extend so as to electrically contact the contact regions, and insulation regions, interposed between the contact projections, in positions corresponding to the projecting regions.
    Type: Application
    Filed: June 5, 2020
    Publication date: September 24, 2020
    Inventors: Francesco SALAMONE, Cristiano Gianluca STELLA
  • Patent number: 10756002
    Abstract: A packaged device, having a package, including a first dissipative region, a second dissipative region, a first connection element and a second connection element. A die of semiconductor material is arranged within the package, carried by the first dissipative region. The first and second dissipative regions extend at a distance from each other, and the first and second connection elements extend at a distance from each other between the first and second dissipative regions. The first dissipative region, the second dissipative region, the first connection element, and the second connection element are hollow and form a circuit containing a cooling liquid.
    Type: Grant
    Filed: January 3, 2019
    Date of Patent: August 25, 2020
    Assignee: STMICROELECTRONICS S.R.L.
    Inventors: Cristiano Gianluca Stella, Francesco Salamone
  • Patent number: 10720373
    Abstract: A semiconductor power device has: a die, with a front surface and a rear surface, and with an arrangement of projecting regions on the front surface, which define between them windows arranged within which are contact regions; and a package, which houses the die inside it. A metal frame has a top surface and a bottom surface; the die is carried by the frame on the top surface; an encapsulation coating coats the frame and the die. A first insulation multilayer is arranged above the die and is formed by an upper metal layer, a lower metal layer, and an intermediate insulating layer; the lower metal layer is shaped according to an arrangement of the projecting regions and has contact projections, which extend so as to electrically contact the contact regions, and insulation regions, interposed between the contact projections, in positions corresponding to the projecting regions.
    Type: Grant
    Filed: March 29, 2019
    Date of Patent: July 21, 2020
    Assignee: STMICROELECTRONICS S.R.L.
    Inventors: Francesco Salamone, Cristiano Gianluca Stella
  • Publication number: 20190311976
    Abstract: A semiconductor power device has: a die, with a front surface and a rear surface, and with an arrangement of projecting regions on the front surface, which define between them windows arranged within which are contact regions; and a package, which houses the die inside it. A metal frame has a top surface and a bottom surface; the die is carried by the frame on the top surface; an encapsulation coating coats the frame and the die. A first insulation multilayer is arranged above the die and is formed by an upper metal layer, a lower metal layer, and an intermediate insulating layer; the lower metal layer is shaped according to an arrangement of the projecting regions and has contact projections, which extend so as to electrically contact the contact regions, and insulation regions, interposed between the contact projections, in positions corresponding to the projecting regions.
    Type: Application
    Filed: March 29, 2019
    Publication date: October 10, 2019
    Inventors: Francesco SALAMONE, Cristiano Gianluca STELLA
  • Publication number: 20190221500
    Abstract: A packaged device, having a package, including a first dissipative region, a second dissipative region, a first connection element and a second connection element. A die of semiconductor material is arranged within the package, carried by the first dissipative region. The first and second dissipative regions extend at a distance from each other, and the first and second connection elements extend at a distance from each other between the first and second dissipative regions. The first dissipative region, the second dissipative region, the first connection element, and the second connection element are hollow and form a circuit containing a cooling liquid.
    Type: Application
    Filed: January 3, 2019
    Publication date: July 18, 2019
    Inventors: Cristiano Gianluca STELLA, Francesco SALAMONE
  • Patent number: 9986631
    Abstract: An electronic power module comprising a case that houses a stack, which includes: a first substrate of a DBC type or the like; a die, integrating an electronic component having one or more electrical-conduction terminals, mechanically and thermally coupled to the first substrate; and a second substrate, of a DBC type or the like, which extends over the first substrate and over the die and presents a conductive path facing the die. The die is mechanically and thermally coupled to the first substrate by a first coupling region of a sintered thermoconductive paste, and the one or more conduction terminals of the electronic component are mechanically, electrically, and thermally coupled to the conductive path of the second substrate by a second coupling region of sintered thermoconductive paste.
    Type: Grant
    Filed: March 25, 2016
    Date of Patent: May 29, 2018
    Assignee: STMICROELECTRONICS S.R.L.
    Inventors: Roberto Rizza, Agatino Minotti, Gaetano Montalto, Francesco Salamone
  • Publication number: 20170064808
    Abstract: An electronic power module comprising a case that houses a stack, which includes: a first substrate of a DBC type or the like; a die, integrating an electronic component having one or more electrical-conduction terminals, mechanically and thermally coupled to the first substrate; and a second substrate, of a DBC type or the like, which extends over the first substrate and over the die and presents a conductive path facing the die. The die is mechanically and thermally coupled to the first substrate by a first coupling region of a sintered thermoconductive paste, and the one or more conduction terminals of the electronic component are mechanically, electrically, and thermally coupled to the conductive path of the second substrate by a second coupling region of sintered thermoconductive paste.
    Type: Application
    Filed: March 25, 2016
    Publication date: March 2, 2017
    Inventors: Roberto Rizza, Agatino Minotti, Gaetano Montalto, Francesco Salamone
  • Patent number: 9570380
    Abstract: An electronic device comprising: a semiconductor die integrating an electronic component; a leadframe housing the semiconductor die; a protection body, which surrounds laterally and at the top the semiconductor die and, at least in part, the leadframe structure, defining a top surface, a bottom surface, and a thickness of the electronic device; and a conductive lead electrically coupled to the semiconductor die. The conductive lead is modelled in such a way as to extend throughout the thickness of the protection body for forming a front electrical contact accessible from the top surface of the electronic device, and a rear electrical contact accessible from the bottom surface of the electronic device.
    Type: Grant
    Filed: September 30, 2015
    Date of Patent: February 14, 2017
    Assignee: STMicroelectronics S.r.l.
    Inventors: Fabio Vito Coppone, Agatino Minotti, Francesco Salamone
  • Publication number: 20160118320
    Abstract: An electronic device comprising: a semiconductor die integrating an electronic component; a leadframe housing the semiconductor die; a protection body, which surrounds laterally and at the top the semiconductor die and, at least in part, the leadframe structure, defining a top surface, a bottom surface, and a thickness of the electronic device; and a conductive lead electrically coupled to the semiconductor die. The conductive lead is modelled in such a way as to extend throughout the thickness of the protection body for forming a front electrical contact accessible from the top surface of the electronic device, and a rear electrical contact accessible from the bottom surface of the electronic device.
    Type: Application
    Filed: September 30, 2015
    Publication date: April 28, 2016
    Inventors: Fabio Vito COPPONE, Agatino MINOTTI, Francesco SALAMONE
  • Publication number: 20130328180
    Abstract: In a manufacturing technique for packaged semiconductor devices, a pre-form of a packaged semiconductor device is formed by a molding process which encapsulates the semiconductor device and its associated heat transfer component in a passivating material presenting a surface. The surface is then processed to at least remove excess passivating material and expose the heat transfer component. The processing may further remove a portion of the heat transfer component. The removal process may, for example, utilize a grinding and/or polishing process. The process may be controlled so as to expose or form a heat transfer surface of desired shape and size.
    Type: Application
    Filed: June 4, 2013
    Publication date: December 12, 2013
    Inventor: Francesco Salamone
  • Publication number: 20130285223
    Abstract: A support structure includes a support cell with a support substrate, junction sacrificial portions surrounding the support substrate, and pin blocks extending from the junction sacrificial portion toward the support substrate. A semiconductor chip is mounted to the support substrate and electrically wire bonded to the pin blocks. An encapsulating body covers the chip, with the pin blocks extending from the body. A transversal groove is formed in each pin block. Surfaces of the pin block and groove are electroplated with solder material. Each pin block is sectioned at the groove to define a pin having a first end corresponding to a portion of the groove surface of the groove and a second end corresponding to the sectioned portion of the pin block that is not electroplated with solder material. Sectioning causes the separation of the chip-insulating body assembly from the junction sacrificial portions.
    Type: Application
    Filed: April 9, 2013
    Publication date: October 31, 2013
    Applicant: STMICROELECTRONICS S.R.L.
    Inventor: Francesco Salamone