Abstract: A laser assembly, such as a flood illuminator, has laser (e.g., VCSEL) emitters on a substrate configured to emit optical signals. An optic structure of optically transparent material, such as a polymer, is formed directly on the substrate, and micro-optic elements are nano-imprinted on the optic structure. The micro-optic elements are arranged in optical communication with the optical signals emitted from the laser emitters to perform field mapping or other optical functions. The laser emitters are on the same surface of the substrate as the optic structure along with electrical contacts so forming the optic structure involves covering the electrical contacts with a protective layer, dispensing a polymer for the optic structure, cutting away portions of the optic structure, removing the remaining protective layer, and exposing the electrical contacts.

Abstract: A display includes a stack that includes, from top to bottom: a display layer including an array of spaced pixels and/or spaced subpixels and an array of spaced transmission spaces, wherein each transmission space is defined by a spacing between a subset of the spaced pixels and/or spaced subpixels; a micro-lens array (MLA) layer including an array of micro-lenses, wherein each micro-lens includes a curved surface in alignment with a corresponding one of the transmission spaces; and a laser light emitting (LLE) layer including an array laser diodes, wherein each laser diode is positioned in alignment with one micro-lens of the MLA layer and the corresponding one of the transmission spaces of the display layer and the curved surfaces of the micro-lenses face the LLE layer.

Abstract: VCSEL-based flood illuminators are fabricated to be compact and surface-mounted devices. A substrate is constructed as a panel array having top and bottom electrodes. Individual ones of the VCSEL dies are mounted in electrical communication with pairs of the top electrodes. The VCSEL dies are encased in an encasement disposed on the top surface of the substrate, and a diffuser structure is nano-imprinted adjacent each of the VCSEL dies. The encasement can use a potting resin and a polymer layer. The potting resin encases the VCSEL dies. The polymer layer is softer and is disposed on the potting resin. Nanoimprint lithography forms the diffuser structures in the polymer layer. The panel array is then singulated to form the individual VCSEL-based flood illuminators.

Abstract: An illumination device includes a laser source, a conventional diffuser element, and an extender optic with a curved interior surface and a curved outer surface. Light emitted by the laser source with a given field of illumination (FOI) is received by the conventional diffuser element and outputted towards the interior surface of the extender optic with an increased FOI; the outer surface of the extender optic then outputs the light received by the interior surface as light with an even greater FOI, typically in the range of 120° to 185°.

Abstract: An illumination device includes a laser source, a conventional diffuser element, and an extender optic with a curved interior surface and a curved exterior surface. Light emitted by the laser source with a given field of illumination (FOI) is received by the conventional diffuser element and outputted towards the interior surface of the extender optic with an increased FOI; the exterior surface of the extender optic then outputs the light received by the interior surface as light with an even greater FOI usually in the range of 120°-185°.

Abstract: An illumination device includes a laser source, a conventional diffuser element, and an extender optic with a curved interior surface and a curved exterior surface. Light emitted by the laser source with a given field of illumination (FOI) is received by the conventional diffuser element and outputted towards the interior surface of the extender optic with an increased FOI; the exterior surface of the extender optic then outputs the light received by the interior surface as light with an even greater FOI, usually in the range of 120°-185°.

Abstract: Small form factor package structures are disclosed for LiNbO3 optical modulator by reducing the package dimension for minimize the unused free space inside a modulator package. If a first aspect of the invention, the structure of the small form factor package for LiNbO3 optical modulator employs a metal round block having an inner part that is made of zirconia or glass like borosilicate BK7 or Pyrex and the outer part that is made with stainless steel or kovar. The inner and outer parts represent a two-pieces optical fiber assembly that are held together by a resin. In a second aspect of the invention, a surface of the lithium niobate chip is attached to a surface of the metal round block (or a glass block) that results in an angular positioning of the lithium niobate chip inside the optical package, which significantly reduces the mechanical stress induced by different polishing angle of the metal round block as well as the polishing angle of the lithium niobate chip.

Abstract: Small form factor package structures are disclosed for LiNbO3 optical modulator by reducing the package dimension for minimize the unused free space inside a modulator package. If a first aspect of the invention, the structure of the small form factor package for LiNbO3 optical modulator employs a metal round block having an inner part that is made of zirconia or glass like borosilicate BK7 or Pyrex and the outer part that is made with stainless steel or kovar. The inner and outer parts represent a two-pieces optical fiber assembly that are held together by a resin. In a second aspect of the invention, a surface of the lithium niobate chip is attached to a surface of the metal round block (or a glass block) that results in an angular positioning of the lithium niobate chip inside the optical package, which significantly reduces the mechanical stress induced by different polishing angle of the metal round block as well as the polishing angle of the lithium niobate chip.

Abstract: A protective system for optical components, including a container, at least one optical component fixed inside said container, a length of optical fiber which has a plastic coating and is connected to said at least one optical component, and, an optical feedthrough for said length of fiber, placed in a feedthrough hole in a wall of said container and hermetically fixed therein, said optical feed through comprising an elongated body which has a longitudinal feedthrough hole into which said optical fiber can be placed, and, a portion of said length of fiber being stripped of said coating, wherein said portion of fiber which is stripped of the coating is soldered to one end of said elongated body by means of a metallic solder, such soldering in a surface portion around said portion of fiber being coated with a layer of a polymeric sealant. The polymeric sealant can be an epoxy resin, an acrylic resin, or a silicon resin.

Abstract: A protective system for optical components, having a container, at least one optical component fixed inside said container and a length of optical fiber (F) which has a plastic coating, connected to said optical component. An optical feedthrough for said section of fiber is placed in a feedthrough hole in a wall of said container and hermetically fixed therein. The optical feedthrough has an elongate body which has a longitudinal feedthrough hole into which said optical fiber (F) can be placed and a portion of said length of fiber (F) being stripped of said coating. The said portion of fiber (F) which is stripped of coating is soldered to one end of said elongate body by means of a metallic solder, and this soldering, in the surface portion around said portion of fiber (F), is coated with a layer of a polymeric sealant.

Abstract: Coupling system between an optical waveguide (1) and an optical device (8) suitable for receiving and/or transmitting an optical beam having a first maximum MFR, comprising a single-mode optical fiber (1) having at one end a portion (10) of its core (2) expanded with a second MFR. An aspherical lens (6) is formed on said end of the fiber (1). Said aspherical lens comprises a pair of inclined surfaces (41, 42) which intersect on a line, generating an edge, in a position substantially corresponding to the center of said core (2), said edge is rounded to form an aspherical profile.

Abstract: Method for performing fixing inside a container for optical connection components, comprising the step of manufacturing a protective packaging from elastomeric material encapsulating at least one optical connection component, inserting said packaging containing said at least one component inside said container, and closing the container itself.