Patents by Inventor Francis F. Cappo

Francis F. Cappo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic component package with decoupling capacitors completely within die receiving cavity of substrate
    Patent number: 5831810
    Abstract: An electronic component package comprising a substrate having at least one die-receiving cavity formed therein, the cavity being defined by a die-receiving surface and an inner sidewall having a terraced contour, the substrate having an exterior surface bordering the cavity perimeter, the inner sidewall extending between the die-receiving surface and the substrate exterior surface, and at least one capacitor positioned completely within the cavity and mounted to the terraced contour of the inner sidewall.
    Type: Grant
    Filed: August 21, 1996
    Date of Patent: November 3, 1998
    Assignee: International Business Machines Corporation
    Inventors: Kenneth A. Bird, Peter J. Brofman, Francis F. Cappo, Jr., Jason L. Frankel, Suresh D. Kadakia, Sarah Huffsmith Knickerbocker, Scott A. Sikorski
  • Interconnection structure and test method
    Patent number: 5147084
    Abstract: Disclosed is a connector structure on a substrate which includes at least one first solder portion on the surface of the substrate; at least one second solder portion connected to each of the at least one first solder portions; and an epoxy layer disposed about the at least one first and second solder portions in such a manner as to cover the first solder portion and contact, but not cover, the second solder portion. Also disclosed is a connector structure on a substrate which includes at least one first solder portion on the surface of said substrate; at least one second solder ball portion connected to the at least one first solder portions; wherein the melting point of the second solder ball portion is relatively higher than that of the first solder portion. Finally, disclosed is a method of testing the solderability of the above structures.
    Type: Grant
    Filed: August 9, 1991
    Date of Patent: September 15, 1992
    Assignee: International Business Machines Corporation
    Inventors: John R. Behun, Anson J. Call, Francis F. Cappo, Marie S. Cole, Karl G. Hoebener, Bruno T. Klingel, John C. Milliken
  • Interconnection structure and test method
    Patent number: 5060844
    Abstract: Disclosed is a connector structure on a substrate which includes at least one first solder portion on the surface of the substrate; at least one second solder portion connected to each of the at least one first solder portions; and an epoxy layer disposed about the at least one first and second solder portions in such a manner as to cover the first solder portion and contact, but not cover, the second solder portion.Also disclosed is a connector structure on a substrate which includes at least one first solder portion on the surface of said substrate; at least one second solder ball portion connected to the at least one first solder portions; wherein the melting point of the second solder ball portion is relatively higher than that of the first solder portion.Finally, disclosed is a method of testing the solderability of the above structures.
    Type: Grant
    Filed: July 18, 1990
    Date of Patent: October 29, 1991
    Assignee: International Business Machines Corporation
    Inventors: John R. Behun, Anson J. Call, Francis F. Cappo, Marie S. Cole, Karl G. Hoebener, Bruno T. Klingel, John C. Milliken