Abstract: An optical subassembly includes: a TSV submount layer carrying an active optical component and a sandwich cap bonded to the TSV submount layer. The sandwich cap includes a bottom spacer layer disposed above the TSV submount layer, a glass layer above the bottom spacer layer, and an upper spacer layer above the glass layer. A cavity is defined in the bottom spacer layer and configured for accommodating the active optical component. At least one first lens is formed on the glass layer and is opposite to the active optical component. An alignment feature is formed in the upper spacer layer.

Abstract: An optical subassembly includes: a TSV submount layer carrying an active optical component and a sandwich cap bonded to the TSV submount layer. The sandwich cap includes a bottom spacer layer disposed above the TSV submount layer, a glass layer above the bottom spacer layer, and an upper spacer layer above the glass layer. A cavity is defined in the bottom spacer layer and configured for accommodating the active optical component. At least one first lens is formed on the glass layer and is opposite to the active optical component. An alignment feature is formed in the upper spacer layer.

Abstract: An optical subassembly includes: a TSV submount layer carrying an active optical component and a sandwich cap bonded to the TSV submount layer. The sandwich cap includes a bottom spacer layer disposed above the TSV submount layer, a glass layer above the bottom spacer layer, and an upper spacer layer above the glass layer. A cavity is defined in the bottom spacer layer and configured for accommodating the active optical component. At least one first lens is formed on the glass layer and is opposite to the active optical component. An alignment feature is formed in the upper spacer layer.

Abstract: A pluggable optical connector with a lock and release mechanism having a slider. The slider includes a handle, two spaced apart longitudinal arms extending from the handle and along two opposite sidewalls of a housing of the connector, two wedges formed at two free ends of the two arms respectively for forcing two deflectable locking tabs formed on a cage outwards when the connector is plugged into the cage and locked therein, and a bridge extending between the two arms. A single transverse leaf spring is positioned between the bridge and a transverse vertical wall extending inwardly from the housing of the connector. The leaf spring exerts spring force in a longitudinal direction, and locking of the connector is released with a reverse movement of the connector countering the spring force.

Abstract: A pluggable optical connector with a lock and release mechanism having a slider. The slider includes a handle, two spaced apart longitudinal arms extending from the handle and along two opposite sidewalls of a housing of the connector, two wedges formed at two free ends of the two arms respectively for forcing two deflectable locking tabs formed on a cage outwards when the connector is plugged into the cage and locked therein, and a bridge extending between the two arms. A single transverse leaf spring is positioned between the bridge and a transverse vertical wall extending inwardly from the housing of the connector. The leaf spring exerts spring force in a longitudinal direction, and locking of the connector is released with a reverse movement of the connector countering the spring force.

Abstract: An optical subassembly includes: a TSV submount layer carrying an active optical component and a sandwich cap bonded to the TSV submount layer. The sandwich cap includes a bottom spacer layer disposed above the TSV submount layer, a glass layer above the bottom spacer layer, and an upper spacer layer above the glass layer. A cavity is defined in the bottom spacer layer and configured for accommodating the active optical component. At least one first lens is formed on the glass layer and is opposite to the active optical component. An alignment feature is formed in the upper spacer layer.

Abstract: An optoelectronic package includes a substrate and a cover element bonded onto the substrate. The cover element defines a cavity for accommodating semiconductor chips and optoelectronic components. The cover element includes a first adhesive bonding area configured for receiving a first adhesive and being bonded with a predetermined region of the substrate by the first adhesive. The engagement of the cover element and the substrate defines a second adhesive bonding area. The second adhesive bonding area is configured for receiving a second adhesive and confining the second adhesive within a localized area. A method for making an optoelectronic package is also provided.

Abstract: An optoelectronic package includes a substrate and a cover element bonded onto the substrate. The cover element defines a cavity for accommodating semiconductor chips and optoelectronic components. The cover element includes a first adhesive bonding area configured for receiving a first adhesive and being bonded with a predetermined region of the substrate by the first adhesive. The engagement of the cover element and the substrate defines a second adhesive bonding area. The second adhesive bonding area is configured for receiving a second adhesive and confining the second adhesive within a localized area. A method for making an optoelectronic package is also provided.

Abstract: A serial electrical connector includes a connector plug and a connector jack. The connector plug includes an audio plug with a hollow cylindrical space formed in the center thereof; a coaxial cable being inserted into and filling the space; and an engagement element being disposed at a tip of the audio plug and configured to electrically connect the audio plug to the connector jack.

Abstract: An optical navigation apparatus comprises a substrate with a sensor integrated circuit and an infrared source formed thereon; a sensor cover shielding the sensor integrated circuit and the infrared source; at least one visible light source formed outside the sensor cover and electrically connected with the substrate; a light guide located outside the sensor cover and covering the visible light source; and an outer housing covering the light guide and the substrate, and the outer housing comprises an infrared window and a side wall capable of guiding visible light towards and illuminating a region of the outer housing. In such an arrangement, the outer housing of the present invention is not only used as a casing for protection, but also served as light guide and distribution structure to reflect and re-distribute light sufficiently to achieve a uniform illuminated character shape.

Abstract: A pluggable optical transceiver includes: a top housing; a bottom housing; and an optical-electrical assembly enclosed by the top housing and the bottom housing. The optical-electrical assembly includes a substrate; at least a transmitting optoelectronic component disposed on the substrate; at least a receiving optoelectronic component disposed on the substrate; interface integrated circuits disposed on the substrate; a pluggable electrical interface disposed on the substrate and electrically connected with the interface integrated circuits; and a coupling optical system.

Abstract: An active optical connector using an audio port includes a plug insertable into a jack having an optical transceiver module. A conductor is mounted on the plug. Optical fibers extend through a central bore of the plug and have front ends held in a fiber ferrule. The jack has a terminal for contacting the conductor on the plug. The optical transceiver module has a receptacle for receiving the fiber ferrule. A light source emits light to an optical fiber, and a photo-detector receives light from another optical fiber. A controller chip has a converting circuit configured to convert electrical signals into optical signal and optical signals into electrical signals.

Abstract: An optical navigation module for receiving control from an object disposed on an operation plane is provided. The optical navigation module includes a substrate defining a base plane that is perpendicular to the operation plane; a light source installed on the base plane of the substrate and configured to emit light to a side of the substrate; an optical structure installed at the side of the substrate; a light sensor installed on the base plane of the substrate; a light shield installed on the base plane of the substrate spatially separating the light source and the light sensor so that light emitted by the light source is not directly shed on the light sensor, the light shield having an aperture formed thereon; and a tactile switch for executing a command installed at a side of the light source that is opposite to the side facing the operation plane.

Abstract: An optoelectronic package includes a substrate and a cover element bonded onto the substrate. The cover element defines a cavity for accommodating semiconductor chips and optoelectronic components. The cover element includes a first adhesive bonding area configured for receiving a first adhesive and being bonded with a predetermined region of the substrate by the first adhesive. The engagement of the cover element and the substrate defines a second adhesive bonding area. The second adhesive bonding area is configured for receiving a second adhesive and confining the second adhesive within a localized area. A method for making an optoelectronic package is also provided.

Abstract: A serial electrical connector includes a connector plug and a connector jack. The connector plug includes an audio plug with a hollow cylindrical space formed in the center thereof; a coaxial cable being inserted into and filling the space; and an engagement element being disposed at a tip of the audio plug and configured to electrically connect the audio plug to the connector jack.

Abstract: A pluggable optical transceiver includes: a top housing; a bottom housing; and an optical-electrical assembly enclosed by the top housing and the bottom housing. The optical-electrical assembly includes a substrate; at least a transmitting optoelectronic component disposed on the substrate; at least a receiving optoelectronic component disposed on the substrate; interface integrated circuits disposed on the substrate; a pluggable electrical interface disposed on the substrate and electrically connected with the interface integrated circuits; and a coupling optical system.

Abstract: An optical navigation module for receiving control from an object disposed on an operation plane is provided. The optical navigation module includes a substrate defining a base plane that is perpendicular to the operation plane; a light source installed on the base plane of the substrate and configured to emit light to a side of the substrate; an optical structure installed at the side of the substrate; a light sensor installed on the base plane of the substrate; a light shield installed on the base plane of the substrate spatially separating the light source and the light sensor so that light emitted by the light source is not directly shed on the light sensor, the light shield having an aperture formed thereon; and a tactile switch for executing a command installed at a side of the light source that is opposite to the side facing the operation plane.

Abstract: An optical navigation apparatus comprises a substrate with a sensor integrated circuit and an infrared source formed thereon; a sensor cover shielding the sensor integrated circuit and the infrared source; at least one visible light source formed outside the sensor cover and electrically connected with the substrate; a light guide located outside the sensor cover and covering the visible light source; and an outer housing covering the light guide and the substrate, and the outer housing comprises an infrared window and a side wall capable of guiding visible light towards and illuminating a region of the outer housing. In such an arrangement, the outer housing of the present invention is not only used as a casing for protection, but also served as light guide and distribution structure to reflect and re-distribute light sufficiently to achieve a uniform illuminated character shape.