Abstract: To prevent degradation of the connectors which connect a driver board to a carrier board, the present invention stress testing equipment positions its connectors at the rear of a moderate temperature section, away from a high temperature oven chamber of the testing equipment. By sealing the interface barrier between the high temperature chamber and the moderate temperature section and by circulating cool air through the moderate temperature section, a temperature gradient is effected along the length of the portion of the carrier board that is located within the moderate temperature section.

Abstract: To provide for portability in the stress testing of electronic components in a high temperature environment, an instrumentation control module having an enclosure for containing the driver electronics which generates signals for operating the electronic components for stress testing may be used. The control module, in particular, has an enclosure for containing a driver card, which has either mounted thereon or integrated thereto the electronics necessary to drive the electronic components, mounted onto a carrier card which is mated to the driver card, by means of connectors, also residing within the enclosure, so as to avoid being exposed to the heat in the high temperature environment. To further insure that no heat would escape from the high temperature environment into the enclosure, a seal gasket is attached to the outside of the enclosure, at the opening where the carrier card is extended from the enclosure and mated with the connector therein.

Abstract: A modular cooling fixture for power transistors include a carrier plate. Transistors are mounted to the plate and insulated transistor leads pass through openings formed in the plate for connection to a printed circuit board. Spacers fasten the board to the carrier plate so that a removable assembly for the transistors is created. A chill plate is juxtaposed in contact with the carrier plate and recesses are formed in the chill plate so that the hat portions of the transistors project into the chill plate, thereby enabling thermal juxtaposed contact between the chill plate and the carrier plate. Passageways are formed through the chill plate to enable the circulation of cooling liquid therethrough. Heat is removed from the transistors by the heat-conductive material of the carrier plate and that heat is then transferred to the chill plate.