Patents by Inventor Francis J. Kelley

Francis J. Kelley has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Compositions and methods for polishing copper
    Patent number: 7497967
    Abstract: The present invention provides an aqueous composition useful for polishing copper interconnects on a semiconductor wafer comprising by weight percent up to 25 oxidizer, 0.05 to 1 inhibitor for a nonferrous metal, 0.01 to 5 complexing agent for the nonferrous metal, 0.01 to 5 modified cellulose, and balance water, wherein the composition is free of polyacrylic acid, the amount of modified cellulose providing a copper removal function and a wafer clear of copper.
    Type: Grant
    Filed: March 24, 2004
    Date of Patent: March 3, 2009
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: Francis J. Kelley, John Quanci, Hongyu Wang
  • Chemical mechanical polishing compositions and methods relating thereto
    Patent number: 7384871
    Abstract: The present invention provides an aqueous composition useful for polishing nonferrous metal interconnects on a semiconductor wafer comprising oxidizer, inhibitor for a nonferrous metal, complexing agent for the nonferrous metal, modified cellulose, 0.01 to 5% by weight copolymer of acrylic acid and methacrylic acid, and balance water, wherein the copolymer of acrylic acid and methacrylic acid has a monomer ratio (acrylic acid/methacrylic acid) in the range of 1:30 to 30:1 and the copolymer has a molecular weight in the range of 1K to 1000K.
    Type: Grant
    Filed: July 1, 2004
    Date of Patent: June 10, 2008
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: Francis J. Kelley, John Quanci, Joseph K. So, Hongyu Wang
  • Chemical mechanical polishing compositions and methods relating thereto
    Patent number: 7303993
    Abstract: The present invention provides an aqueous composition useful for CMP of a semiconductor wafer containing a metal comprising oxidizer, inhibitor for a nonferrous metal, complexing agent for the nonferrous metal, modified cellulose, 0.001 to 10% by weight copolymer blends of a first copolymer and a second copolymer and balance water.
    Type: Grant
    Filed: July 1, 2004
    Date of Patent: December 4, 2007
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: Francis J. Kelley, John Quanci, Joseph K. So, Hongyu Wang