Patents by Inventor Francis J. Verderame

Francis J. Verderame has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for soldering and apparatus therefor
    Patent number: 5169057
    Abstract: A method is provided for soldering using tin-containing solder to substrate surfaces that are gold plated wherein a selected portion of the gold plated surface is treated by impacting with a high velocity stream of fine nickel containing abrasive particles to remove all the gold from the treated surface and then effecting joining to the treated surface by conventional soldering techniques.
    Type: Grant
    Filed: September 30, 1991
    Date of Patent: December 8, 1992
    Assignee: EMC Technology, Inc.
    Inventors: Robert J. Blacka, Francis J. Verderame
  • Apparatus for the treatment of articles by high velocity impacting thereof with a particulate abrasive material
    Patent number: 5052155
    Abstract: A method is provided for soldering using tin-containing solder to substrate surfaces that are gold plated wherein a selected portion of the gold plated surface is treated by impacting with a high velocity stream of fine nickel containing abrasive particles to remove all the gold from the treated surface and then effecting joining to the treated surface by conventional soldering techniques.
    Type: Grant
    Filed: August 10, 1989
    Date of Patent: October 1, 1991
    Assignee: EMC Technology, Inc.
    Inventors: Robert J. Blacka, Francis J. Verderame