Patents by Inventor Francis MONCHAL

Francis MONCHAL has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Current sensor device
    Patent number: 11927606
    Abstract: A sensor device includes a silicon substrate having an active surface; a first sensing area disposed near a first edge of the active surface of the silicon substrate such that the first sensing area has at least one first magnetic sensing element is made of a first compound semiconductor material and contact pads; and a second sensing area disposed near a second edge of the active surface of the silicon substrate, such that the second edge is substantially opposite to the first edge, such that the second sensing area has at least one second magnetic sensing element made of a second compound semiconductor material and contact pads. A processing circuit is disposed of in the silicon substrate and is electrically connected via wire bonds and/or a redistribution layer with the contact pads of the first and second sensing areas.
    Type: Grant
    Filed: November 29, 2022
    Date of Patent: March 12, 2024
    Assignee: MELEXIS TECHNOLOGIES SA
    Inventors: Lucian Barbut, Francis Monchal, Simon Houis, Lionel Tombez
  • CURRENT SENSOR DEVICE
    Publication number: 20230086851
    Abstract: A sensor device includes a silicon substrate having an active surface; a first sensing area disposed near a first edge of the active surface of the silicon substrate such that the first sensing area has at least one first magnetic sensing element is made of a first compound semiconductor material and contact pads; and a second sensing area disposed near a second edge of the active surface of the silicon substrate, such that the second edge is substantially opposite to the first edge, such that the second sensing area has at least one second magnetic sensing element made of a second compound semiconductor material and contact pads. A processing circuit is disposed of in the silicon substrate and is electrically connected via wire bonds and/or a redistribution layer with the contact pads of the first and second sensing areas.
    Type: Application
    Filed: November 29, 2022
    Publication date: March 23, 2023
    Inventors: Lucian BARBUT, Francis MONCHAL, Simon HOUIS, Lionel TOMBEZ
  • Current sensor device
    Patent number: 11531046
    Abstract: A sensor device includes a silicon substrate having an active surface; a first sensing area disposed near a first edge of the active surface of the silicon substrate such that the first sensing area has at least one first magnetic sensing element is made of a first compound semiconductor material and contact pads; and a second sensing area disposed near a second edge of the active surface of the silicon substrate, such that the second edge is substantially opposite to the first edge, such that the second sensing area has at least one second magnetic sensing element made of a second compound semiconductor material and contact pads. A processing circuit is disposed of in the silicon substrate and is electrically connected via wire bonds and/or a redistribution layer with the contact pads of the first and second sensing areas.
    Type: Grant
    Filed: September 24, 2021
    Date of Patent: December 20, 2022
    Assignee: MELEXIS TECHNOLOGIES SA
    Inventors: Lucian Barbut, Francis Monchal, Simon Houis, Lionel Tombez
  • CURRENT SENSOR DEVICE
    Publication number: 20220099709
    Abstract: A sensor device includes a silicon substrate having an active surface; a first sensing area disposed near a first edge of the active surface of the silicon substrate such that the first sensing area has at least one first magnetic sensing element is made of a first compound semiconductor material and contact pads; and a second sensing area disposed near a second edge of the active surface of the silicon substrate, such that the second edge is substantially opposite to the first edge, such that the second sensing area has at least one second magnetic sensing element made of a second compound semiconductor material and contact pads. A processing circuit is disposed of in the silicon substrate and is electrically connected via wire bonds and/or a redistribution layer with the contact pads of the first and second sensing areas.
    Type: Application
    Filed: September 24, 2021
    Publication date: March 31, 2022
    Inventors: Lucian BARBUT, Francis MONCHAL, Simon HOUIS, Lionel TOMBEZ