Patents by Inventor Francis Mutuku

Francis Mutuku has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Low temperature melting and mid temperature melting lead-free solder paste with mixed solder alloy powders
    Patent number: 11712762
    Abstract: Implementations of the disclosure are directed to a lead-free mixed solder powder paste suitable for low temperature to middle temperature soldering applications. The lead-free solder paste may consist of: an amount of a first solder alloy powder between 44 wt % and 83 wt %, the first solder alloy powder comprising Sn; an amount of a second solder alloy powder between 5 wt % to 44 wt %, the second alloy powder comprising Sn, where the first solder alloy powder has a liquidus temperature lower than a solidus temperature of the second solder alloy powder; and a remainder of flux. The solder paste may be used for reflow at a peak temperature below the solidus temperature of the higher solidus temperature solder powder but above the melting temperature of the lower solidus temperature one.
    Type: Grant
    Filed: March 7, 2022
    Date of Patent: August 1, 2023
    Assignee: INDIUM CORPORATION
    Inventors: Hongwen Zhang, Fen Chen, Francis Mutuku, Jie Geng, Ning-Cheng Lee
  • LOW TEMPERATURE MELTING AND MID TEMPERATURE MELTING LEAD-FREE SOLDER PASTE WITH MIXED SOLDER ALLOY POWDERS
    Publication number: 20220184749
    Abstract: Implementations of the disclosure are directed to a lead-free mixed solder powder paste suitable for low temperature to middle temperature soldering applications. The lead-free solder paste may consist of: an amount of a first solder alloy powder between 44 wt % and 83 wt %, the first solder alloy powder comprising Sn; an amount of a second solder alloy powder between 5 wt % to 44 wt %, the second alloy powder comprising Sn, where the first solder alloy powder has a liquidus temperature lower than a solidus temperature of the second solder alloy powder; and a remainder of flux. The solder paste may be used for reflow at a peak temperature below the solidus temperature of the higher solidus temperature solder powder but above the melting temperature of the lower solidus temperature one.
    Type: Application
    Filed: March 7, 2022
    Publication date: June 16, 2022
    Inventors: Hongwen Zhang, Fen Chen, Francis Mutuku, Jie Geng, Ning-Cheng Lee
  • Low temperature melting and mid temperature melting lead-free solder paste with mixed solder alloy powders
    Patent number: 11267080
    Abstract: Implementations of the disclosure are directed to a lead-free mixed solder powder paste suitable for low temperature to middle temperature soldering applications. The lead-free solder paste may consist of: an amount of a first solder alloy powder between 44 wt % and 83 wt %, the first solder alloy powder comprising Sn; an amount of a second solder alloy powder between 5 wt % to 44 wt %, the second alloy powder comprising Sn, where the first solder alloy powder has a liquidus temperature lower than a solidus temperature of the second solder alloy powder; and a remainder of flux. The solder paste may be used for reflow at a peak temperature below the solidus temperature of the higher solidus temperature solder powder but above the melting temperature of the lower solidus temperature one.
    Type: Grant
    Filed: July 22, 2019
    Date of Patent: March 8, 2022
    Assignee: INDIUM CORPORATION
    Inventors: Hongwen Zhang, Fen Chen, Francis Mutuku, Jie Geng, Ning-Cheng Lee
  • LOW TEMPERATURE MELTING AND MID TEMPERATURE MELTING LEAD-FREE SOLDER PASTE WITH MIXED SOLDER ALLOY POWDERS
    Publication number: 20200353572
    Abstract: Implementations of the disclosure are directed to a lead-free mixed solder powder paste suitable for low temperature to middle temperature soldering applications. The lead-free solder paste may consist of: an amount of a first solder alloy powder between 44 wt % and 83 wt %, the first solder alloy powder comprising Sn; an amount of a second solder alloy powder between 5 wt % to 44 wt %, the second alloy powder comprising Sn, where the first solder alloy powder has a liquidus temperature lower than a solidus temperature of the second solder alloy powder; and a remainder of flux. The solder paste may be used for reflow at a peak temperature below the solidus temperature of the higher solidus temperature solder powder but above the melting temperature of the lower solidus temperature one.
    Type: Application
    Filed: July 22, 2019
    Publication date: November 12, 2020
    Inventors: Hongwen Zhang, Fen Chen, Francis Mutuku, Jie Geng, Ning-Cheng Lee