Patents by Inventor Francis P. Morana

Francis P. Morana has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110009012
    Abstract: A method of forming an electrical connector includes winding a conducting wire around a carrier strip, cutting the carrier strip to a desired length, forming the carrier strip into a cylindrical member to form an inner tube subassembly, and inserting the inner tube subassembly into an outer tube.
    Type: Application
    Filed: August 30, 2010
    Publication date: January 13, 2011
    Inventors: Francis P. Morana, Mark M. Ayzenberg
  • Patent number: 7805838
    Abstract: A method of forming an electrical connector includes winding a conducting wire around a carrier strip, cutting the carrier strip to a desired length, forming the carrier strip into a cylindrical member to form an inner tube subassembly, and inserting the inner tube subassembly into an outer tube.
    Type: Grant
    Filed: August 2, 2007
    Date of Patent: October 5, 2010
    Assignee: Hypertronics Corporation
    Inventors: Francis P. Morana, Mark M. Ayzenberg
  • Publication number: 20090036003
    Abstract: A method of forming an electrical connector includes winding a conducting wire around a carrier strip, cutting the carrier strip to a desired length, forming the carrier strip into a cylindrical member to form an inner tube subassembly, and inserting the inner tube subassembly into an outer tube.
    Type: Application
    Filed: August 2, 2007
    Publication date: February 5, 2009
    Inventors: Francis P. Morana, Mark M. Ayzenberg
  • Patent number: 7244126
    Abstract: An electrical connector comprises a housing holding a circuit board. The circuit board has a top surface which includes a first region and a second region. Circuit traces are formed on the top surface and extend in the first and second regions. A first ground plane is disposed at a first depth in the circuit board below the circuit traces in the first region. The first depth is selected to provide a specific characteristic impedance of the circuit traces in the first region. A second ground plane is disposed at a second depth in the circuit board below the circuit traces in the second region. The second depth is selected to provide a specific characteristic impedance of the circuit traces in the second region.
    Type: Grant
    Filed: December 9, 2005
    Date of Patent: July 17, 2007
    Assignee: Tyco Electronics Corporation
    Inventors: Francis P. Morana, Dennis Dupler, Charles Adams
  • Patent number: 7090525
    Abstract: A connector for electrical, telephonic and/or data transmission for selective engagement with a complementary receptacle, is provided. The connector includes a housing defining a pair of channels extending into slots at a rear surface of the housing and capable of supporting a contact member therein. The connector further includes a lanyard operatively associated with the housing. The lanyard includes locking and releasing arms slidably disposed within each channel of the housing, and an extracting tab selectively engageable with each locking and releasing arm. Additionally, the extracting tab includes a pair of legs insertable into a respective slot at the back of the housing. Each leg includes an engaging member projecting from an inner surface thereof for engaging a respective aperture formed in the slider. Desirably, the extracting tab is snap-fit connected to each locking and releasing arm.
    Type: Grant
    Filed: February 9, 2005
    Date of Patent: August 15, 2006
    Assignee: Tyco Electronics Corporation
    Inventor: Francis P. Morana
  • Patent number: 7001190
    Abstract: An electrical contact for a ball grid array connector includes a platform for holding a solder ball and a body having a first end frictionally coupled to the platform and an opposite second end that includes a separable interface configured to mate with a mating contact. The body is separable from the platform when the platform is mounted to a circuit board.
    Type: Grant
    Filed: April 26, 2004
    Date of Patent: February 21, 2006
    Assignee: Tyco Electronics Corporation
    Inventors: Francis P. Morana, David S. Szczesny
  • Patent number: 6955545
    Abstract: An electrical contact for a ball grid array connector includes a plate for holding a solder ball and a contact body having a first end and a second end. The plate is removably coupled to the body first end. A separable interface extends from the body second end. The separable interface is configured to receive a mating contact.
    Type: Grant
    Filed: April 27, 2004
    Date of Patent: October 18, 2005
    Assignee: Tyco Electronics Corporation
    Inventors: Francis P. Morana, David S. Szczesny
  • Patent number: 6945810
    Abstract: A double ended guide pin includes an elongated body having first and second opposite ends extending along a longitudinal axis of the body and an attachment portion centrally located between the first and second ends. Each of the first and second ends includes at least one keying surface and each of the first and second ends is receivable in a guide that has a channel corresponding to the at least one keying surface.
    Type: Grant
    Filed: April 28, 2004
    Date of Patent: September 20, 2005
    Assignee: Tyco Electronics Corporation
    Inventors: Francis P. Morana, David S. Szczesny, Nancy Reeser
  • Patent number: 6926563
    Abstract: A low profile contact includes a resilient spring portion having a first end and a second end, and a first contact beam and a second contact beam extending from the respective first and second ends of the spring portion. The first contact beam and the second contact beam have substantially parallel distal end portions, and at least one of the distal end portions includes an upstanding guide surface configured to receive and align a connection pin between the distal end portions. The guide surface extends from an upper edge of the contact beam and has a flared tip to receive a pin therebetween as the pin is inserted along an insertion axis perpendicular to a longitudinal axis of the first and second distal end portions.
    Type: Grant
    Filed: July 22, 2003
    Date of Patent: August 9, 2005
    Assignee: Tyco Electronics Corporation
    Inventors: Francis P. Morana, David S. Szczesny
  • Publication number: 20030064626
    Abstract: A docking connector system has been provided that includes a plurality of interchangeable plug and header chicklets, or terminal modules. Each interchangeable plug and header chicklet includes a plurality of signal contact pairs with corresponding signal pins and a plurality of ground contacts with corresponding ground pins. The signal contact pairs are arranged in a pattern in which a ground contact is positioned between any two signal contact pairs in the same row. Further, a ground contact is positioned between any two signal contact pairs in the same column. The signal contact pairs in one row of the pattern are staggered relative to the signal contact pairs in an adjacent row of the pattern. That is, signal pairs in adjacent rows do not line up with each other. Each plug and header chicklet also includes a plurality of signal pins and a plurality of ground pins. Each signal pin is attached to a signal contact pair, while each ground pin is attached to a ground contact.
    Type: Application
    Filed: September 28, 2001
    Publication date: April 3, 2003
    Inventors: Dennis L. Kemmick, Francis P. Morana
  • Patent number: 6540559
    Abstract: A docking connector system has been provided that includes a plurality of interchangeable plug and header chicklets, or terminal modules. Each interchangeable plug and header chicklet includes a plurality of signal contact pairs with corresponding signal pins and a plurality of ground contacts with corresponding ground pins. The signal contact pairs are arranged in a pattern in which a ground contact is positioned between any two signal contact pairs in the same row. Further, a ground contact is positioned between any two signal contact pairs in the same column. The signal contact pairs in one row of the pattern are staggered relative to the signal contact pairs in an adjacent row of the pattern. That is, signal pairs in adjacent rows do not line up with each other. Each plug and header chicklet also includes a plurality of signal pins and a plurality of ground pins. Each signal pin is attached to a signal contact pair, while each ground pin is attached to a ground contact.
    Type: Grant
    Filed: September 28, 2001
    Date of Patent: April 1, 2003
    Assignee: Tyco Electronics Corporation
    Inventors: Dennis L. Kemmick, Francis P. Morana