Patents by Inventor Francis P. Morana
Francis P. Morana has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20110009012Abstract: A method of forming an electrical connector includes winding a conducting wire around a carrier strip, cutting the carrier strip to a desired length, forming the carrier strip into a cylindrical member to form an inner tube subassembly, and inserting the inner tube subassembly into an outer tube.Type: ApplicationFiled: August 30, 2010Publication date: January 13, 2011Inventors: Francis P. Morana, Mark M. Ayzenberg
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Patent number: 7805838Abstract: A method of forming an electrical connector includes winding a conducting wire around a carrier strip, cutting the carrier strip to a desired length, forming the carrier strip into a cylindrical member to form an inner tube subassembly, and inserting the inner tube subassembly into an outer tube.Type: GrantFiled: August 2, 2007Date of Patent: October 5, 2010Assignee: Hypertronics CorporationInventors: Francis P. Morana, Mark M. Ayzenberg
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Publication number: 20090036003Abstract: A method of forming an electrical connector includes winding a conducting wire around a carrier strip, cutting the carrier strip to a desired length, forming the carrier strip into a cylindrical member to form an inner tube subassembly, and inserting the inner tube subassembly into an outer tube.Type: ApplicationFiled: August 2, 2007Publication date: February 5, 2009Inventors: Francis P. Morana, Mark M. Ayzenberg
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Patent number: 7244126Abstract: An electrical connector comprises a housing holding a circuit board. The circuit board has a top surface which includes a first region and a second region. Circuit traces are formed on the top surface and extend in the first and second regions. A first ground plane is disposed at a first depth in the circuit board below the circuit traces in the first region. The first depth is selected to provide a specific characteristic impedance of the circuit traces in the first region. A second ground plane is disposed at a second depth in the circuit board below the circuit traces in the second region. The second depth is selected to provide a specific characteristic impedance of the circuit traces in the second region.Type: GrantFiled: December 9, 2005Date of Patent: July 17, 2007Assignee: Tyco Electronics CorporationInventors: Francis P. Morana, Dennis Dupler, Charles Adams
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Patent number: 7090525Abstract: A connector for electrical, telephonic and/or data transmission for selective engagement with a complementary receptacle, is provided. The connector includes a housing defining a pair of channels extending into slots at a rear surface of the housing and capable of supporting a contact member therein. The connector further includes a lanyard operatively associated with the housing. The lanyard includes locking and releasing arms slidably disposed within each channel of the housing, and an extracting tab selectively engageable with each locking and releasing arm. Additionally, the extracting tab includes a pair of legs insertable into a respective slot at the back of the housing. Each leg includes an engaging member projecting from an inner surface thereof for engaging a respective aperture formed in the slider. Desirably, the extracting tab is snap-fit connected to each locking and releasing arm.Type: GrantFiled: February 9, 2005Date of Patent: August 15, 2006Assignee: Tyco Electronics CorporationInventor: Francis P. Morana
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Patent number: 7001190Abstract: An electrical contact for a ball grid array connector includes a platform for holding a solder ball and a body having a first end frictionally coupled to the platform and an opposite second end that includes a separable interface configured to mate with a mating contact. The body is separable from the platform when the platform is mounted to a circuit board.Type: GrantFiled: April 26, 2004Date of Patent: February 21, 2006Assignee: Tyco Electronics CorporationInventors: Francis P. Morana, David S. Szczesny
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Patent number: 6955545Abstract: An electrical contact for a ball grid array connector includes a plate for holding a solder ball and a contact body having a first end and a second end. The plate is removably coupled to the body first end. A separable interface extends from the body second end. The separable interface is configured to receive a mating contact.Type: GrantFiled: April 27, 2004Date of Patent: October 18, 2005Assignee: Tyco Electronics CorporationInventors: Francis P. Morana, David S. Szczesny
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Patent number: 6945810Abstract: A double ended guide pin includes an elongated body having first and second opposite ends extending along a longitudinal axis of the body and an attachment portion centrally located between the first and second ends. Each of the first and second ends includes at least one keying surface and each of the first and second ends is receivable in a guide that has a channel corresponding to the at least one keying surface.Type: GrantFiled: April 28, 2004Date of Patent: September 20, 2005Assignee: Tyco Electronics CorporationInventors: Francis P. Morana, David S. Szczesny, Nancy Reeser
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Patent number: 6926563Abstract: A low profile contact includes a resilient spring portion having a first end and a second end, and a first contact beam and a second contact beam extending from the respective first and second ends of the spring portion. The first contact beam and the second contact beam have substantially parallel distal end portions, and at least one of the distal end portions includes an upstanding guide surface configured to receive and align a connection pin between the distal end portions. The guide surface extends from an upper edge of the contact beam and has a flared tip to receive a pin therebetween as the pin is inserted along an insertion axis perpendicular to a longitudinal axis of the first and second distal end portions.Type: GrantFiled: July 22, 2003Date of Patent: August 9, 2005Assignee: Tyco Electronics CorporationInventors: Francis P. Morana, David S. Szczesny
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Publication number: 20030064626Abstract: A docking connector system has been provided that includes a plurality of interchangeable plug and header chicklets, or terminal modules. Each interchangeable plug and header chicklet includes a plurality of signal contact pairs with corresponding signal pins and a plurality of ground contacts with corresponding ground pins. The signal contact pairs are arranged in a pattern in which a ground contact is positioned between any two signal contact pairs in the same row. Further, a ground contact is positioned between any two signal contact pairs in the same column. The signal contact pairs in one row of the pattern are staggered relative to the signal contact pairs in an adjacent row of the pattern. That is, signal pairs in adjacent rows do not line up with each other. Each plug and header chicklet also includes a plurality of signal pins and a plurality of ground pins. Each signal pin is attached to a signal contact pair, while each ground pin is attached to a ground contact.Type: ApplicationFiled: September 28, 2001Publication date: April 3, 2003Inventors: Dennis L. Kemmick, Francis P. Morana
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Patent number: 6540559Abstract: A docking connector system has been provided that includes a plurality of interchangeable plug and header chicklets, or terminal modules. Each interchangeable plug and header chicklet includes a plurality of signal contact pairs with corresponding signal pins and a plurality of ground contacts with corresponding ground pins. The signal contact pairs are arranged in a pattern in which a ground contact is positioned between any two signal contact pairs in the same row. Further, a ground contact is positioned between any two signal contact pairs in the same column. The signal contact pairs in one row of the pattern are staggered relative to the signal contact pairs in an adjacent row of the pattern. That is, signal pairs in adjacent rows do not line up with each other. Each plug and header chicklet also includes a plurality of signal pins and a plurality of ground pins. Each signal pin is attached to a signal contact pair, while each ground pin is attached to a ground contact.Type: GrantFiled: September 28, 2001Date of Patent: April 1, 2003Assignee: Tyco Electronics CorporationInventors: Dennis L. Kemmick, Francis P. Morana