Abstract: A method is provided for removing a component from a medium. The method includes applying an adhesive to a portion of a component. An attachment member is inserted into the portion of the component. The attachment member is pulled with a pulling element in a direction opposite a medium in which the component is inserted.

Abstract: A method and apparatus are provided for removing a component from a medium, where the apparatus includes an attachment member insertable into a portion of a component, an amount of adhesive for adhering the attachment member to the component, and a pulling element. The method includes pulling, with the pulling element, the attachment member in a direction opposite a medium in which the component is inserted.

Abstract: A detailing tool for processing electronic component substrate includes a supporting frame, a substrate carrier movable on the supporting frame to receive and secure the substrate during processing by the tool, and a pair of cutter assembly attached to said supporting frame for removing tails on said substrate. The cutter assemblies self-align “to” the substrate during initial substrate loading in a processing area of the tool. Each cutter assembly includes a pair of spaced, translatable and opposed cutters that simultaneously move towards each another while removing the tails from the corners of the substrate that remains stationary. The pair of cutter assemblies are symmetrically attached to the supporting frame with respect to an axis for indexing the substrate. Thus, the invention provides a tool for cutting tails from opposite corners on the substrate edge automatically and simultaneously during processing.

Abstract: A detailing tool for processing electronic component substrate includes a supporting frame, a substrate carrier movable on the supporting frame to receive and secure the substrate during processing by the tool, and a pair of cutter assembly attached to said supporting frame for removing tails on said substrate. The cutter assemblies self-align “to” the substrate during initial substrate loading in a processing area of the tool. Each cutter assembly includes a pair of spaced, translatable and opposed cutters that simultaneously move towards each another while removing the tails from the corners of the substrate that remains stationary. The pair of cutter assemblies are symmetrically attached to the supporting frame with respect to an axis for indexing the substrate. Thus, the invention provides a tool for cutting tails from opposite corners on the substrate edge automatically and simultaneously during processing.

Abstract: A process and apparatus are provided for preparing a release layer suitable for facilitating release of green ceramic laminates from a lamination fixture. The process comprises applying an electrostatic charge to at least one variably electrostatically chargeable portion of at least one lamination fixture and dispensing a layer of ceramic particulates, glass particulates or glass-ceramic particulates onto the charged portion of the lamination fixture to form a release layer on the lamination fixture. The apparatus provides a particulate dispenser for dispensing a layer of particulates of ceramic, glass, or ceramic-glass mixture, at least one lamination fixture having at least one variably electrostatically chargeable portion disposed in particulate receiving communication with the particulate dispenser; and a variable voltage electrostatic generator in electrical communication with the at least one chargeable portion of the lamination fixture.

Abstract: A system for chemical-mechanical polishing is described which includes a wafer backing film having concentric first and second portions, and a wafer carrier having corresponding first and second portions for mounting the portions of the wafer backing film thereon. The portions of the wafer backing film are of different materials. The second portion of the wafer backing film has an annular shape and surrounds the first portion; the second portion of the wafer carrier is adjustable with respect to the first portion of the wafer carrier in a vertical direction. The second portion of the wafer backing film is less compressible than the first portion, and is adjusted in the vertical direction so that the outer edge of the wafer is substantially sealed when backside air is applied to the wafer during a film removal process.

Abstract: The provision of a container system that has a compartmented core surrounded by a carrier body frame to which top and bottom covers are removably attached. A band of resilient sealing material (e.g., a closed cell inert polymer or a rubber) on the top and bottom covers each completely surrounds the compartment core, and three ribs on the top and bottom of each of the covers likewise frame the compartment core, so that the ribs engage the resilient sealing material and form a barrier that completely surrounds the compartment core.