Patents by Inventor Francis Steffen

Francis Steffen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10332313
    Abstract: The disclosure describes systems and methods related to moving object content that is enhanced with textual content presented using rapid serial visual presentation (“RSVP”). In one embodiment, video content is enhanced with RSPV content. Related embodiments provide systems and methods for displaying, creating, and editing such content. A particular embodiment provides for RSPV enhanced video previews. In another embodiment, augmented reality content is enhanced with RSVP content. In some embodiments, RSPV enhanced moving object content is provided on various end user electronic devices including smart phones, smart watches, and head mounted displays. These and other embodiments are disclosed further herein.
    Type: Grant
    Filed: August 1, 2016
    Date of Patent: June 25, 2019
    Assignee: Spritz Holding LLC
    Inventors: Francis Abbott Waldman, Maik Steffen Maurer, Oleg Skrypnyuk
  • Patent number: 9226393
    Abstract: A circuit including a flexible substrate and at least one electric element attached to the substrate, the substrate including at least one cavity arranged near the electric element and helping to break or distort the electric element in response to a flexion or stretching of the substrate. Application in particular is to the manufacture of tear-proof electronic micromodules.
    Type: Grant
    Filed: October 10, 2014
    Date of Patent: December 29, 2015
    Assignee: STMicroelectronics (Rousset) SAS
    Inventors: Francis Steffen, Gilbert Assaud
  • Patent number: 9196590
    Abstract: An electronic package includes an integrated circuit chip mounted to a support plate and encapsulated by an encapsulating body. The package includes at least one weakening deep perforation. The perforation is formed in either the support plate or the encapsulating body, and functions to reduce a resistance of the package to bending stresses perpendicular to the support plate.
    Type: Grant
    Filed: March 6, 2015
    Date of Patent: November 24, 2015
    Assignees: STMicroelectronics (Grenoble 2) SAS, STMicroelectronics (Rousset) SAS
    Inventors: Francis Steffen, Delphine Mathey, Gilbert Assaud, Rémi Brechignac
  • Publication number: 20150262941
    Abstract: An electronic package includes an integrated circuit chip mounted to a support plate and encapsulated by an encapsulating body. The package includes at least one weakening deep perforation. The perforation is formed in either the support plate or the encapsulating body, and functions to reduce a resistance of the package to bending stresses perpendicular to the support plate.
    Type: Application
    Filed: March 6, 2015
    Publication date: September 17, 2015
    Applicants: STMicroelectronics (Grenoble 2) SAS, STMicroelectronics (Rousset) SAS
    Inventors: Francis Steffen, Delphine Mathey, Gilbert Assaud, Rémi Brechignac
  • Publication number: 20150029275
    Abstract: A circuit including a flexible substrate and at least one electric element attached to the substrate, the substrate including at least one cavity arranged near the electric element and helping to break or distort the electric element in response to a flexion or stretching of the substrate. Application in particular is to the manufacture of tear-proof electronic micromodules.
    Type: Application
    Filed: October 10, 2014
    Publication date: January 29, 2015
    Inventors: Francis Steffen, Gilbert Assaud
  • Patent number: 8867217
    Abstract: A circuit including a flexible substrate and at least one electric element attached to the substrate, the substrate including at least one cavity arranged near the electric element and helping to break or distort the electric element in response to a flexion or stretching of the substrate. Application in particular is to the manufacture of tear-proof electronic micromodules.
    Type: Grant
    Filed: January 29, 2010
    Date of Patent: October 21, 2014
    Assignee: STMicroelectronics Rousset SAS
    Inventors: Francis Steffen, Gilbert Assaud
  • Publication number: 20100194645
    Abstract: A circuit including a flexible substrate and at least one electric element attached to the substrate, the substrate including at least one cavity arranged near the electric element and helping to break or distort the electric element in response to a flexion or stretching of the substrate. Application in particular is to the manufacture of tear-proof electronic micromodules.
    Type: Application
    Filed: January 29, 2010
    Publication date: August 5, 2010
    Applicant: STMICROELECTRONICS ROUSSET SAS
    Inventors: Francis Steffen, Gilbert Assaud
  • Publication number: 20060270110
    Abstract: A method electrically connects a semiconductor chip, having contact pads, with an interconnection support, having a substrate and reception pads. The method comprises a step of growing a first metal layer on the contact pads of the chip and a step of growing a second metal layer on the reception pads of the interconnection support, by metal electrodeposition, until the first and the second metal layers meet and form an electrical contact linking the contact pads of the chip and the reception pads of the interconnection support. The method can be applied to the manufacture of electronic cards and electronic modules.
    Type: Application
    Filed: May 9, 2006
    Publication date: November 30, 2006
    Applicant: STMicroelectronics S.A.
    Inventor: Francis Steffen
  • Publication number: 20060261456
    Abstract: An electronic micromodule, particularly for smart card, comprises an electrically insulating substrate, at least one conductive sheet in an electrically conductive material, which rear face is attached to a front face of the substrate, and a semi-conductor chip. The substrate comprises an opening forming a window of access to the rear face of the conductive sheet, the chip is arranged within the opening and is fixed onto the rear face of the conductive sheet, and at least one contact of the chip is electrically connected to the rear face of the conductive sheet by means of an electrically conductive connecting material. The electronic micromodule may embody chip cards, electronic badges and electronic tags.
    Type: Application
    Filed: May 9, 2006
    Publication date: November 23, 2006
    Applicant: STMicroelectronics S.A.
    Inventor: Francis Steffen
  • Patent number: 6259022
    Abstract: A micromodule is used as a surface-mounted package on a substrate of interconnections. In one embodiment of the invention, barriers to the expansion of solder are formed between contact zones of the micromodule and corresponding contact pads of the substrate. A mechanical stopping device is planned to keep the thickness of the interface of solder. In another embodiment of the invention, contact zones are extended by tongues. A cambering operation enables the formation of the surface-mounting pins.
    Type: Grant
    Filed: October 19, 1998
    Date of Patent: July 10, 2001
    Assignee: SGS-Thomson Microelectronics S.A.
    Inventor: Francis Steffen
  • Patent number: 6071758
    Abstract: A method for the manufacture of a micromodule with surface flush connector, the metallic regions of the connector being formed on a support grid, comprises the formation of protection barriers between the regions of the connector so as to form a closed contour demarcating a molding zone around the chip, outside a standardized space reserved for the physical connections between the connector of the micromodule and an external system, to make a molding of thermohardening or thermoplastic material around the chip in this demarcated molding zone.
    Type: Grant
    Filed: November 13, 1996
    Date of Patent: June 6, 2000
    Assignee: SGS-Thomson Microelectronics S.A.
    Inventor: Francis Steffen
  • Patent number: 5917706
    Abstract: A micromodule is used as a surface-mounted package on a substrate of interconnections. In one embodiment of the invention, barriers to the expansion of solder are formed between contact zones of the micromodule and corresponding contact pads of the substrate. A mechanical stopping device is planned to keep the thickness of the interface of solder. In another embodiment of the invention, contact zones are extended by tongues. A cambering operation enables the formation of the surface-mounting pins.
    Type: Grant
    Filed: May 28, 1996
    Date of Patent: June 29, 1999
    Assignee: SGS-Thomson Microelectronics S.A.
    Inventor: Francis Steffen
  • Patent number: 5898216
    Abstract: A method for the manufacture of a micromodule with surface flush connector, the metallic regions of the connector being formed on a support grid, comprises the formation of protection barriers between the regions of the connector so as to form a closed contour demarcating a molding zone around the chip, outside a standardized space reserved for the physical connections between the connector of the micromodule and an external system, to make a molding of thermohardening or thermoplastic material around the chip in this demarcated molding zone.
    Type: Grant
    Filed: July 21, 1997
    Date of Patent: April 27, 1999
    Assignee: SGS-Thomson Microelectronics S.A.
    Inventor: Francis Steffen
  • Patent number: 5574270
    Abstract: A chip card system provided with an offset portable electronic circuit includes a module that integrates one or more electronic components, a reader 4 of this module, an intermediate means 3 directly linked with the reader 4 and a conveyance means 2 to provide for the transmission of information between the module 1 and the intermediate means 3, and vice versa. The intermediate means is a chip card that enables access to standard readers. The module can be used to set up a complex application without any problem as regards available surface areas. Moreover, the reliability obtained is that of the mounting of electronic components. It is far greater than that obtained in the technology of mounting a chip in a chip card.
    Type: Grant
    Filed: June 10, 1993
    Date of Patent: November 12, 1996
    Assignee: SGS-Thomson Microelectronics, S.A.
    Inventor: Francis Steffen
  • Patent number: 5311396
    Abstract: A portable and connectable chip-based electronic system has one or more chips integrated into a package. The electronic component obtained is mounted, in a first embodiment, on the upper surface of metal contacts. A lower surface has metal contacts that constitute the connector of the system. Each of the metal contacts of the upper face is connected to and faces a metal contact of the lower surface, and vice versa. In a second embodiment, the electronic component is surface mounted on an upper surface of metal contacts, the lower surface of these contacts forming the connector. A system such as this is designed to be inserted into a reader which will get connected to the connector. Such a system may have other electronic components that are mutually interconnected and interconnected with the electronic component.
    Type: Grant
    Filed: August 31, 1992
    Date of Patent: May 10, 1994
    Assignee: SGS-Thomson Microelectronics, S.A.
    Inventor: Francis Steffen
  • Patent number: 5147982
    Abstract: The disclosure concerns the encapsulation of integrated circuit chips, notably with a view to their being incorporated in a chip card. The encapsulation method comprises the formation of a pre-punched metallic conductive grid, the formation of a strip of pre-perforated plastic material, the transfer of a strip to the grid, the positioning of an integrated circuit chip in a perforation of the strip, and the formation of electrical connections between the chip and zones of the grid located in perforations of the strip. The perforations of the strip and the punched slots of the grid are arranged so that the strip covers and blocks all the interstices between conductors of the grid in the useful region corresponding to a module to be made. When a protecting resin is laid, it is confined and does not leak through the interstices of the grid. A plastic or metal ring defines the heightwise dimension of the micromodule.
    Type: Grant
    Filed: April 10, 1991
    Date of Patent: September 15, 1992
    Assignee: SGS-Thomson Microelectronics S.A.
    Inventor: Francis Steffen
  • Patent number: 5107073
    Abstract: A housing designed to contain a logic circuit (15) comprising two shells (11a, 11b) each including a welding area (17a, 17b) having an appropriate geometry permitting ultrasonic welding, such that when both shells are assembled before a welding phase, they are shifted along a vertical axis (20). The supporting plate (13) comprises a mounting ear (23) while the shells comprise a receptacle (33a, 33b). During the welding phase, there is no concomitant contact between any of the upper face (26) and lower face (27) of the ear (23) and the corresponding bearing faces (34a, 34b) of the receptacles, owing to a shift (21). The shift is reduced and the concomitant contact takes place between the bearing faces (34a, 34b) of the receptacles and each of the upper and lower faces (26, 27) of the ear (23) only when the welding phase is completed.
    Type: Grant
    Filed: December 14, 1988
    Date of Patent: April 21, 1992
    Assignee: SGS-Thomson Microelectronics S.A.
    Inventor: Francis Steffen
  • Patent number: 5041395
    Abstract: The disclosure concerns the encapsulation of integrated circuit chips, notably with a view to their being incorporated in a chip card. The encapsulation method comprises the formation of a pre-punched metallic conductive grid, the formation of a strip of pre-perforated plastic material, the transfer of a strip to the grid, the positioning of an integrated circuit chip in a perforation of the strip, and the formation of electrical connections between the chip and zones of the grid located in perforations of the strip. The perforations of the strip and the punched slots of the grid are arranged so that the strip covers and blocks all the interstices between conductors of the grid in the useful region corresponding to a module to be made. When a protecting resin is laid, it is confined and does not leak through the interstices of the grid. A plastic or metal ring defines the heightwise dimension of the micromodule.
    Type: Grant
    Filed: April 5, 1990
    Date of Patent: August 20, 1991
    Assignee: SGS-Thomson Microelectronics S.A.
    Inventor: Francis Steffen
  • Patent number: 4857483
    Abstract: To encapsulate integrated circuits mounted on continuous dielectrical strips (surface-mounted circuits) it is proposed to transfer mold a thermosetting resin around circuits carried by the strip, the resin being injected outside the parting plane of the mold, contrary to the usual practice in this field. The protection of the circuits is improved while, at the same time, the ability to test the strip is preserved.
    Type: Grant
    Filed: December 29, 1987
    Date of Patent: August 15, 1989
    Assignee: SGS-Thomson Microelectronics S.A.
    Inventors: Francis Steffen, Jean Labelle
  • Patent number: RE36208
    Abstract: A housing designed to contain a logic circuit (15) comprising two shells (11a, 11b) each including a welding area (17a, 17b) having an appropriate geometry permitting ultrasonic welding, such that when both shells are assembled before a welding phase, they are shifted along a vertical axis (20). The supporting plate (13) comprises a mounting ear (23) while the shells comprise a receptacle (33a, 33b). During the welding phase, there is no concomitant contact between any of the upper face (26) and lower face (27) of the ear (23) and the corresponding bearing faces (34a, 34b) of the receptacles, owing to a shift (21). The shift is reduced and the concomitant contact takes place between the bearing faces (34a, 34b) of the receptacles and each of the upper and lower faces (26, 27) of the ear (23) only when the welding phase is completed.
    Type: Grant
    Filed: April 21, 1994
    Date of Patent: May 11, 1999
    Assignee: SGS-Thomson Microelectronics S.A.
    Inventor: Francis Steffen