Abstract: Aspects of the disclosure herein relate to systems and methods for heating, cooling, and/or displaying food. A food display system may include a base; a support engaged with the base; a canopy supported by the support, the canopy having a top surface, a bottom surface, and an edge surface between the top and bottom surfaces, the edge surface having at least a first portion and a second portion; and a light source configured to provide light to the first portion of the edge surface of the canopy and illuminate the second portion of the edge surface of the canopy. The canopy may be configured to be located above a food item.

Abstract: Aspects of the disclosure herein relate to systems and methods for heating, cooling, and/or displaying food. A food display system may include a base; a support engaged with the base; a canopy supported by the support, the canopy having a top surface, a bottom surface, and an edge surface between the top and bottom surfaces, the edge surface having at least a first portion and a second portion; and a light source configured to provide light to the first portion of the edge surface of the canopy and illuminate the second portion of the edge surface of the canopy. The canopy may be configured to be located above a food item.

Abstract: Aspects of the invention support simultaneous operation of a cooling side and a heating side of an apparatus to change the temperatures of a cooling serving surface and a heating serving surface, respectively. A cooling semiconductor device (which may comprise one or more Peltier devices) transfers heat from its top to its bottom while a heating semiconductor device (which may similarly comprise one or more Peltier devices) transfers heat from its bottom to its top. A heat pipe transfers waste heat from the cooling semiconductor device's bottom to the heating semiconductor device's bottom and waste cold from the heating semiconductor device's bottom to the cooling semiconductor device's bottom.

Abstract: An induction cooktop may be reconfigured to be used as a built-in side-by-side warmer model, a built-in front-back warmer model, a countertop side-by-side warmer model, and a countertop front-back warmer model. The cooktop may include a housing with two warmers and a control panel for supplying power to the warmers. The control panel may be detached from one side of the cooktop and reattached to another side, thereby reconfiguring the cooktop from a side-by-side warmer model to a front-back warmer model. The inclusion of a ledge around the periphery of the housing may allow the cooktop to be used as both a built-in model and a countertop model.

Abstract: Aspects of the invention support simultaneous operation of a cooling side and a heating side of an apparatus to change the temperatures of a cooling serving surface and a heating serving surface, respectively. A cooling semiconductor device (which may comprise one or more Peltier devices) transfers heat from its top to its bottom while a heating semiconductor device (which may similarly comprise one or more Peltier devices) transfers heat from its bottom to its top. A heat pipe transfers waste heat from the cooling semiconductor device's bottom to the heating semiconductor device's bottom and waste cold from the heating semiconductor device's bottom to the cooling semiconductor device's bottom.

Abstract: Aspects of the invention support simultaneous operation of a cooling side and a heating side of an apparatus to change the temperatures of a cooling serving surface and a heating serving surface, respectively. A cooling semiconductor device (which may comprise one or more Peltier devices) transfers heat from its top to its bottom while a heating semiconductor device (which may similarly comprise one or more Peltier devices) transfers heat from its bottom to its top. A heat pipe transfers waste heat from the cooling semiconductor device's bottom to the heating semiconductor device's bottom and waste cold from the heating semiconductor device's bottom to the cooling semiconductor device's bottom.

Abstract: Aspects of the invention support simultaneous operation of a cooling side and a heating side of an apparatus to change the temperatures of a cooling serving surface and a heating serving surface, respectively. A cooling semiconductor device (which may comprise one or more Peltier devices) transfers heat from its top to its bottom while a heating semiconductor device (which may similarly comprise one or more Peltier devices) transfers heat from its bottom to its top. A heat pipe transfers waste heat from the cooling semiconductor device's bottom to the heating semiconductor device's bottom and waste cold from the heating semiconductor device's bottom to the cooling semiconductor device's bottom.

Abstract: Aspects of the invention support the changing of a serving surface temperature in order to cool or heat the serving surface. Heat is transferred to or from the serving surface through at least one Peltier device, a heat pipe, and a heat sink. The mode of operation is determined by changing the electrical power polarity to the at least one Peltier device. A control device may activate the at least one Peltier device from a measured temperature and a temperature setting with a hysteresis. A plurality of Peltier devices may be partitioned into different subsets so that the control device may activate a selected subset during different time intervals. When the measured temperature is outside a temperature range, all of the Peltier devices may be activated, while only a selected subset may be activated when the measured temperature is within the temperature range and until a hysteresis temperature is reached.

Abstract: A hinged cover for a cooking utensil comprising a cover body having a cutout portion, a hinged section fitted within the cutout portion and pivotally attached to the cover body. The cover body and hinged section have circumferential perimeters which, when combined, define a total circumference of the hinged cover, wherein the perimeter of the hinged section is less than 50% of the total circumference of the hinged cover to prevent the cover from falling into the utensil when the hinged section is raised. Access can be gained to the cooking utensil by raising the hinged cover for removing or adding food products to the interior of the utensil without removing or otherwise displacing the cover from the cooking utensil.