Patents by Inventor Francis Wessling, III

Francis Wessling, III has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multilayer circuit board with electrically resistive heating element
    Patent number: 6114674
    Abstract: A multilayer circuit board and an associated heating apparatus is provided for heating electrical components. The multilayer circuit board includes a trace layer having at least one electrical trace terminating with a contact pad that is positioned to electrically contact a respective lead of an electrical component mounted upon the multilayer circuit board. The multilayer circuit board also includes a heating layer disposed in thermal contact with the electrical component mounted upon the multilayer circuit board. The heating layer includes a first electrically resistive heating element disposed upon an insulating substrate in general alignment with the electrical component mounted upon the multilayer circuit board. The electrically resistive heating element provides heat to maintain the operating temperature of the electrical component within a desired range.
    Type: Grant
    Filed: October 3, 1997
    Date of Patent: September 5, 2000
    Assignee: McDonnell Douglas Corporation
    Inventors: Walter Thomas Baugh, Stephen Mark Kusek, Francis Wessling, III