Abstract: A process for applying heat shrink film to containers comprising the steps of a) coating at least a portion of a heat shrinkable but unshrunken film segment with a reactive hot melt polyurethane adhesive having a free isocyante content greater than 2% and a viscosity less than 3000 cps at 225.degree. F.; b) applying the film to the longitudinal surface of the container; and, c) subjecting the container to heat to shrink the film onto the container so as to permanently affix it thereto.

Abstract: Hot melt adhesive compositions are prepared from 20 to 90% by weight of a linear polyester of 3-hydroxybutyric and 3-hydroxyvaleric acids containing 9 to 35% of the hydroxyvalerate component; 10 to 80% by weight of a polar tackifier having a Ring and Ball softening (as described by ASTM E-26) greater than about 60.degree. C.; 0 to 50% by weight of a plasticizer; 0 to 30% by weight of a wax diluent and 0-3% by weight of a stabilizer; 0-20% of a compatible polymer. By utilizing a naturally occurring, thermoplastic, biodegradable copolymer as the base polymer, these adhesives advance the state of the art of hot melt adhesives by alleviating the dependence on petroleum based materials and by allowing for the development of hot melt adhesives which either degrade naturally after coming in contact with the soil or which can be composted.

Abstract: Insulation assemblies for the HVAC industry are bonded by spray application of a hot melt adhesive composition comprising 10 to 50 percent of an isostactic thermoplastic polybutene-1/ethylene copolymer containing from about 5.5 to about 10% by weight ethylene; 20 to 50 percent of a tackifier; 15 to 50 percent of an amorphous diluent having a softening point greater than 90.degree. C.; 0 to 2 percent antioxidant; and 0 to 5 percent wax.

Abstract: Hot melt packaging adhesive compositions consisting essentially of 35 to 45% by weight of an ethylene n-butyl acrylate copolymer containing 25-45% by weight, preferably 30 to 40% n-butyl acrylate and having a melt index of at least 50; 35 to 55% of a terpene phenolic tackifier; and 10 to 20% by weight of a high melting synthetic wax provide adhesives characterized by an excellent balance of high and low temperature performance without sacrifice to machinability or thermal stability.

Abstract: Hot melt packaging adhesive compositions consisting essentially of 35 to 45% by weight of an ethylene n-butyl acrylate copolymer containing 25-45% by weight, preferably 30 to 40% n-butyl acrylate and having a melt index of at least 50; 35 to 55% of a terpene phenolic tackifier; and 10 to 20% by weight of a high melting synthetic wax provide adhesives characterized by an excellent balance of high and low temperature performance without sacrifice to machinability or thermal stability.