Abstract: A light-field optical image system with dual mode, having a main lens (103), a microlens array (102), an image sensor (101) and a first actuator (201) configured to cause a relative displacement between the image sensor (101) and the microlens array (102) to switch between at least two different optical configurations including: a light-field configuration, in which the image sensor (101) and the microlens array (102) are separated by a first distance (107a) that allows the image sensor (101) to capture a light-field image; and a 2D imaging configuration, in which the image sensor (101) and the microlens array (102) are separated by a second distance (107b), lower than the first distance (107a), that allows the image sensor (101) to avoid the light-field effect.

Abstract: An optical system (400) including a microlens array (104), an image sensor (108) and a PCB (206). The microlens array (104) is bonded to the image sensor (108) with glue lines (804) or glue drops (802) dispensed around the non-active area (404) of the microlens array (104). The image sensor (108) may be bonded to the PCB (206) with a layer of adhesive material (502) applied only on a central region of the image sensor (108). Alternatively, the image sensor can rest onto a thermally conductive resin layer (109) placed over a stiffener (207), and the image sensor can be attached to the PCB (206) by one or more glue drops (111) or glue lines (113) arranged on at least one side of the image sensor (108) or by an adhesive layer (115) laterally surrounding the image sensor (108). The optical system (400) solves the problem of misalignment between the image sensor and the microlens array caused by changes in temperature.

Abstract: An optical system (400) including a microlens array (104), an image sensor (108) and aPCB (206). The microlens array (104) is bonded to the image sensor (108) with glue lines (804) or glue drops (802) dispensed around the non-active area (404) of the microlens array (104). The image sensor (108) may be bonded to the PCB (206) with a layer of adhesive material (502) applied only on a central region of the image sensor (108). Alternatively, the image sensor can rest onto a thermally conductive resin layer (109) placed over a stiffener (207), and the image sensor can be attached to the PCB (206) by one or more glue drops (111) or glue lines (113) arranged on at least one side of the image sensor (108) or by an adhesive layer (115) laterally surrounding the image sensor (108). The optical system (400) solves the problem of misalignment between the image sensor and the microlens array caused by changes in temperature.

Abstract: A plenoptic camera for mobile devices is provided, having a main lens, a microlens array, an image sensor, and a first reflective element configured to reflect the light rays captured by the plenoptic camera before arriving at the image sensor, in order to fold the optical path of the light captured by the camera before impinging the image sensor. Additional reflective elements may also be used to further fold the light path inside the camera. The reflective elements can be prisms, mirrors or reflective surfaces of three-sided optical elements having two refractive surfaces that form a lens element of the main lens. By equipping mobile devices with this plenoptic camera, the focal length can be greatly increased while maintaining the thickness of the mobile device under current constraints.

Abstract: A plenoptic camera for mobile devices is provided, having a main lens, a microlens array, an image sensor, and a first reflective element configured to reflect the light rays captured by the plenoptic camera before arriving at the image sensor, in order to fold the optical path of the light captured by the camera before impinging the image sensor. Additional reflective elements may also be used to further fold the light path inside the camera. The reflective elements can be prisms, mirrors or reflective surfaces of three-sided optical elements having two refractive surfaces that form a lens element of the main lens. By equipping mobile devices with this plenoptic camera, the focal length can be greatly increased while maintaining the thickness of the mobile device under current constraints.