Patents by Inventor Francisco Chairez

Francisco Chairez has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus and method for opening a sealed module containing a circuit board
    Patent number: 7243418
    Abstract: An apparatus and method is provided which permits effective removal of a circuit board from sealed housing while minimizing stress, bending and flexing of circuit board sufficiently to prevent damage to circuit board and its electronic components. The apparatus includes a base to support the housing and a force transmitter to transmit a separation force to the exposed surfaces of one or more connectors of the circuit board. This apparatus effectively distributes the separation force across exposed surfaces of the connectors to create substantially uniform pressure on the connectors and thus the circuit board. The invention also includes steps for separating the circuit board from the housing including, in one embodiment, a separator apparatus for applying a pulling force to the connectors of the circuit board.
    Type: Grant
    Filed: June 22, 2004
    Date of Patent: July 17, 2007
    Assignee: Cummins, Inc.
    Inventors: Tomas Murillo, Jr., Francisco Chairez, Jose Monreal
  • Apparatus and method for opening a sealed module containing a circuit board
    Publication number: 20050278925
    Abstract: An apparatus and method is provided which permits effective removal of a circuit board from sealed housing while minimizing stress, bending and flexing of circuit board sufficiently to prevent damage to circuit board and its electronic components. The apparatus includes a base to support the housing and a force transmitter to transmit a separation force to the exposed surfaces of one or more connectors of the circuit board. This apparatus effectively distributes the separation force across exposed surfaces of the connectors to create substantially uniform pressure on the connectors and thus the circuit board. The invention also includes steps for separating the circuit board from the housing including, in one embodiment, a separator apparatus for applying a pulling force to the connectors of the circuit board.
    Type: Application
    Filed: June 22, 2004
    Publication date: December 22, 2005
    Applicant: Cummins Inc
    Inventors: Tomas Murillo, Francisco Chairez, Jose Monreal