Patents by Inventor Francisco D. Alves

Francisco D. Alves has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Chip carrier for an integrated circuit assembly
    Patent number: 5262674
    Abstract: Epoxy bonding between an IC chip and a chip carrier is strengthened by creating substantially rougher oxidized surfaces within substantially smooth gold surfaces of a die paddle portion of the chip carrier.
    Type: Grant
    Filed: April 9, 1992
    Date of Patent: November 16, 1993
    Assignee: Motorola, Inc.
    Inventors: Kingshuk Banerji, Kenneth R. Thompson, Francisco D. Alves
  • Vacuum infiltration of underfill material for flip-chip devices
    Patent number: 5203076
    Abstract: A method of attaching an integrated circuit (10) to a substrate (20) starts with electrically interconnecting (14) the integrated circuit on the substrate. Next, a bead of underfill material (22) is provided on the substrate (20) about the periphery (24) of the integrated circuit (10). At least a partial vacuum (34) is then applied to the integrated circuit (10) and the substrate (20) to substantially evacuate the area (18) between the integrated circuit (10) and the substrate (20). Finally, fluid pressure (42) is applied to the integrated circuit (10) and the substrate (20) to force at least a portion of the underfill material (22) into the area (18) between the integrated circuit (10) and the substrate (20).
    Type: Grant
    Filed: December 23, 1991
    Date of Patent: April 20, 1993
    Assignee: Motorola, Inc.
    Inventors: Kingshuk Banerji, Francisco D. Alves, Robert F. Darveaux