Abstract: A template for polishing semiconductor wafers is provided. In the present invention, the edge profile of semiconductor wafers polished in a wax-free process is enhanced by the addition of an edge enhancement ring on the back of the polishing template. The edge enhancement ring may be formed directly as part of the template, or may be an add-on part, such as a double side stick tape or the like. By utilizing an edge enhancement ring, the edge profile of a polished wafer may be significantly improved such that an edge exclusion may be reduced or eliminated, thus providing more usable surface area of the polished wafer.