Abstract: The present invention provides a system and method for making a three-dimensional electronic, electromagnetic or electromechanical component/device by: (1) creating one or more layers of a three-dimensional substrate by depositing a substrate material in a layer-by-layer fashion, wherein the substrate includes a plurality of interconnection cavities and component cavities; (2) filling the interconnection cavities with a conductive material; and (3) placing one or more components in the component cavities.

Abstract: Systems and methods for creating interlayer mechanical or electrical attachments or connections using filaments within a three-dimensional structure, structural component, or structural electronic, electromagnetic, or electromechanical component/device.

Abstract: The present invention provides systems and methods for embedding a filament or filament mesh in a three-dimensional structure, structural component, or structural electronic, electromagnetic or electromechanical component/device by providing at least a first layer of a substrate material, and embedding at least a portion of a filament or filament mesh within the first layer of the substrate material such the portion of the filament or filament mesh is substantially flush with a top surface of the first layer and a substrate material in a flowable state is displaced by the portion of the filament and does not substantially protrude above the top surface of the first layer, allowing the continuation of an additive manufacturing process above the embedded filament or filament mesh.

Abstract: An electronic gaming die includes an enclosure, a flexible substrate, a number of light emitting diodes, a sensor, a processor and a battery. The enclosure has N sides where N is equal to or greater than 4. The flexible substrate folds into N sides and fits into an interior of the enclosure, wherein each side has an inner face, an outer face and is assigned an integer from 1 to N. The light emitting diodes are disposed on the outer face of each side of the flexible substrate, wherein the number of light emitting diodes equals the integer assigned to the side of the flexible substrate. The sensor, processor and battery are disposed on one of the inner faces of the flexible substrate.

Abstract: An electronic gaming die includes an enclosure, a flexible substrate, a number of light emitting diodes, a sensor, a processor and a battery. The enclosure has N sides where N is equal to or greater than 4. The flexible substrate folds into N sides and fits into an interior of the enclosure, wherein each side has an inner face, an outer face and is assigned an integer from 1 to N. The light emitting diodes are disposed on the outer face of each side of the flexible substrate, wherein the number of light emitting diodes equals the integer assigned to the side of the flexible substrate. The sensor, processor and battery are disposed on one of the inner faces of the flexible substrate.

Abstract: An electronic gaming die includes an enclosure, a flexible substrate, a number of light emitting diodes, a sensor, a processor and a battery. The enclosure has N sides where N is equal to or greater than 4. The flexible substrate folds into N sides and fits into an interior of the enclosure, wherein each side has an inner face, an outer face and is assigned an integer from 1 to N. The light emitting diodes are disposed on the outer face of each side of the flexible substrate, wherein the number of light emitting diodes equals the integer assigned to the side of the flexible substrate. The sensor, processor and battery are disposed on one of the inner faces of the flexible substrate.

Abstract: A finisher for a vehicle console assembly includes a body having an upper surface, a lower surface, and an opening defined therethrough, the opening having a forward end, a rear end, and opposing sides extending therebetween, and a lower light shield extending from the lower surface. The lower light shield includes a canopy having a hood formed at the rear end of the opening, the hood extending away from the lower surface and toward the forward end of the opening. The hood is configured to cover at least a portion of the opening.

Abstract: The present invention provides systems and methods for creating interlayer mechanical or electrical attachments or connections using filaments within a three-dimensional structure, structural component, or structural electronic, electromagnetic or electromechanical component/device.

Abstract: An electronic gaming die includes an enclosure, a flexible substrate, a number of light emitting diodes, a sensor, a processor and a battery. The enclosure has N sides where N is equal to or greater than 4. The flexible substrate folds into N sides and fits into an interior of the enclosure, wherein each side has an inner face, an outer face and is assigned an integer from 1 to N. The light emitting diodes are disposed on the outer face of each side of the flexible substrate, wherein the number of light emitting diodes equals the integer assigned to the side of the flexible substrate. The sensor, processor and battery are disposed on one of the inner faces of the flexible substrate.

Abstract: The present invention provides systems and methods for embedding a filament or filament mesh in a three-dimensional structure, structural component, or structural electronic, electromagnetic or electromechanical component/device by providing at least a first layer of a substrate material, and embedding at least a portion of a filament or filament mesh within the first layer of the substrate material such the portion of the filament or filament mesh is substantially flush with a top surface of the first layer and a substrate material in a flowable state is displaced by the portion of the filament and does not substantially protrude above the top surface of the first layer, allowing the continuation of an additive manufacturing process above the embedded filament or filament mesh.

Abstract: The present invention provides a system and method for making a three-dimensional electronic, electromagnetic or electromechanical component/device by: (1) creating one or more layers of a three-dimensional substrate by depositing a substrate material in a layer-by-layer fashion, wherein the substrate includes a plurality of interconnection cavities and component cavities; (2) filling the interconnection cavities with a conductive material; and (3) placing one or more components in the component cavities.

Abstract: The present invention relates to a mycotoxin adsorbent, as well as to the process for the preparation of said adsorbent. The adsorbent of the invention is based on the combination of an organic silicate with an amorphous structure and dodecylamine, that is to say, a primary amine having an apolar, linear, aliphatic long-chain of twelve carbon atoms. The invention also relates to the use of said adsorbent in feeds for the adsorption of mycotoxins, especially for the adsorption of mycotoxins such as aflatoxins, zearalenone, ochratoxin A or fumonisin B1. Furthermore, the invention relates, on the one hand, to a feed additive comprising said adsorbent and, on the other hand, to the feeds comprising said additive.

Abstract: An integrated system and method of integrating fluid dispensing technologies (e.g., direct-write (DW)) with rapid prototyping (RP) technologies (e.g., stereolithography (SL)) without part registration comprising: an SL apparatus and a fluid dispensing apparatus further comprising a translation mechanism adapted to translate the fluid dispensing apparatus along the Z-, Y- and Z-axes. The fluid dispensing apparatus comprises: a pressurized fluid container; a valve mechanism adapted to control the flow of fluid from the pressurized fluid container; and a dispensing nozzle adapted to deposit the fluid in a desired location. To aid in calibration, the integrated system includes a laser sensor and a mechanical switch. The method further comprises building a second part layer on top of the fluid deposits and optionally accommodating multi-layered circuitry by incorporating a connector trace.

Abstract: A preferred embodiment of the present invention provides a method and system for building cost-efficient biocompatible hydrogel constructs using stereolithography. Hydrogel constructs may be used in, for example, multi-lumen nerve regeneration conduits and other tissue engineering scaffolds with embedded channel architecture that facilitate tissue regeneration through possible incorporation of precisely located bioactive agents, cells, and other desired inert and/or active chemical agents and devices. Another preferred embodiment of the present invention provides a method of fabricating a hydrogel construct comprising: solidifying a first solution into a first construct layer with a first energy dosage using stereolithography, the first solution comprising: a first polymer; and a first photoinitiator, wherein the first polymer and first photoinitiator are of a first concentration.

Abstract: Methods and systems of stereolithography for building cost-efficient and time-saving multi-material, multi-functional and multi-colored prototypes, models and devices configured for intermediate washing and curing/drying is disclosed including: laser(s), liquid and/or platform level sensing system(s), controllable optical system(s), moveable platform(s), elevator platform(s), recoating system(s) and at least one polymer retaining receptacle. Multiple polymer retaining receptacles may be arranged in a moveable apparatus, wherein each receptacle is adapted to actively/passively maintain a uniform, desired level of polymer by including a recoating device and a material fill/remove system. The platform is movably accessible to the polymer retaining receptacle(s), elevator mechanism(s) and washing and curing/drying area(s) which may be housed in a shielded enclosure(s).

Abstract: A preferred embodiment of the present invention provides a method and system for building cost-efficient biocompatible hydrogel constructs using stereolithography. Hydrogel constructs may be used in, for example, multi-lumen nerve regeneration conduits and other tissue engineering scaffolds with embedded channel architecture that facilitate tissue regeneration through possible incorporation of precisely located bioactive agents, cells, and other desired inert and/or active chemical agents and devices. Another preferred embodiment of the present invention provides a method of fabricating a hydrogel construct comprising: solidifying a first solution into a first construct layer with a first energy dosage using stereolithography, the first solution comprising: a first polymer; and a first photoinitiator, wherein the first polymer and first photoinitiator are of a first concentration.

Abstract: The present invention relates to a mycotoxin adsorbent, as well as to the process for the preparation of said adsorbent. The adsorbent of the invention is based on the combination of an organic silicate with an amorphous structure and dodecylamine, that is to say, a primary amine having an apolar, linear, aliphatic long-chain of twelve carbon atoms. The invention also relates to the use of said adsorbent in feeds for the adsorption of mycotoxins, especially for the adsorption of mycotoxins such as aflatoxins, zearalenone, ochratoxin A or fumonisin B1. Furthermore, the invention relates, on the one hand, to a feed additive comprising said adsorbent and, on the other hand, to the feeds comprising said additive.

Abstract: A preferred embodiment of the present invention provides a method and system for building cost-efficient biocompatible hydrogel constructs using stereolithography. Hydrogel constructs may be used in, for example, multi-lumen nerve regeneration conduits and other tissue engineering scaffolds with embedded channel architecture that facilitate tissue regeneration through possible incorporation of precisely located bioactive agents, cells, and other desired inert and/or active chemical agents and devices. Another preferred embodiment of the present invention provides a method of fabricating a hydrogel construct comprising: solidifying a first solution into a first construct layer with a first energy dosage using stereolithography, the first solution comprising: a first polymer; and a first photoinitiator, wherein the first polymer and first photoinitiator are of a first concentration.

Abstract: An integrated system and method of integrating fluid dispensing technologies (e.g., direct-write (DW)) with rapid prototyping (RP) technologies (e.g., stereolithography (SL)) without part registration comprising: an SL apparatus and a fluid dispensing apparatus further comprising a translation mechanism adapted to translate the fluid dispensing apparatus along the Z-, Y- and Z-axes. The fluid dispensing apparatus comprises: a pressurized fluid container; a valve mechanism adapted to control the flow of fluid from the pressurized fluid container; and a dispensing nozzle adapted to deposit the fluid in a desired location. To aid in calibration, the integrated system includes a laser sensor and a mechanical switch. The method further comprises building a second part layer on top of the fluid deposits and optionally accommodating multi-layered circuitry by incorporating a connector trace.

Abstract: An integrated system and method of integrating fluid dispensing technologies (e.g., direct-write (DW)) with rapid prototyping (RP) technologies (e.g., stereolithography (SL)) without part registration comprising: an SL apparatus and a fluid dispensing apparatus further comprising a translation mechanism adapted to translate the fluid dispensing apparatus along the Z-, Y- and Z-axes. The fluid dispensing apparatus comprises: a pressurized fluid container; a valve mechanism adapted to control the flow of fluid from the pressurized fluid container; and a dispensing nozzle adapted to deposit the fluid in a desired location. To aid in calibration, the integrated system includes a laser sensor and a mechanical switch. The method further comprises building a second part layer on top of the fluid deposits and optionally accommodating multi-layered circuitry by incorporating a connector trace.