Abstract: A defect detection and imaging system is presented for performing microscopy and/or spectroscopy on a device under test. The defect detection system comprises a controller for toggling the state of a light source, which may allow for fast simultaneous high-speed inspection and high-resolution review imaging of the device under test by the same system and simultaneously deliver inspection, computer generated reconstructions or tomography, and defect review on sub second time-scales. The defect detection system further comprises a converter for converting X-ray images of the device under test into photoelectron contrast images to achieve nanometer scale measurement resolution in non-destructive and real-time fashion, to complement or replace destructive TEM. These photoelectron contrast images may be received by a detector to output an electronic format map or 3D/4D image that indicates one or more features of the device under test.

Abstract: A defect detection system comprising of an incoherent light source and a collimating light source attachment to produce spatially coherent light waves (e.g., X-rays) that are capable of deeply penetrating a device under test (e.g., a semiconductor). Changes in the spatial coherency of the light waves incident upon the device under test may be utilized to generate one or more electronic maps that indicate one or more defects within the device under test, such as, cracks, gaps, and/or air pockets within the device under test.

Abstract: A defect detection system comprising of an incoherent light source and a collimating light source attachment to produce spatially coherent light waves (e.g., X-rays) that are capable of deeply penetrating a device under test (e.g., a semiconductor). Changes in the spatial coherence of the light waves incident upon the device under test may be utilized to generate one or more electronic maps that indicate one or more physical gauges for length, area, or volume, one or more concentration of elements or distributions in space, and one or more defects within the device under test, such as, cracks, breaks, gaps, and/or air pockets within the device under test.