Abstract: A method of selectively metallizing a thermoplastic substrate using a hot foil embossing technique, a patterned metal layer being transferred to the substrate from a metal foil by a cutting and pressing procedure including steps (a) and (b). In step (a) the patterned metal layer is first cut from the foil using a punch-press at a selected pressure p.sub.a. In step (b) the cut patterned metal layer is then attached to the substrate using a press at a pressure p.sub.b which is .ltoreq.10 N/mm.sup.2 and also <p.sub.a, and a temperature T.sub.b .gtoreq.100.degree. C. This avoids concurrent application of high pressure and high temperature, which could cause formation of upset edges at the surface of the substrate.

Abstract: A method of selectively metallising an inner, electrically insulating surface S.sub.i of an open body (3), comprising the following steps:(a) providing a roller (2) having a resilient outer surface S.sub.o ;(b) providing a layer of a suitable wet ink on the surface S.sub.o, according to a given pattern;(c) causing the roller (2) to roll along the surface S.sub.i so as to impart a patterned layer of wet ink from the surface S.sub.o to the surface S.sub.i ;(d) allowing the patterned layer of wet ink imparted to the surface S.sub.i to dry;(e) selectively depositing metallic material upon the patterned layer of dry ink thus obtained.Such a method is particularly suited to the manufacture of a scan velocity modulator (1) for use in a cathode ray tube.