Abstract: An electronic circuit comprises a plurality of input/output (I/O) nodes for connecting the electronic circuit to a further electronic circuit via interconnects. A main unit implements a normal mode function of the electronic circuit. A test unit tests the interconnects. The electronic circuit has a normal mode in which the I/O nodes are logically connected to the main unit and a test mode in which the I/O nodes are logically connected to the test unit. In the test mode the test unit is operable as a low complexity memory via the I/O nodes.

Abstract: An electronic circuit comprises a plurality of input/output (I/O) nodes for connecting the electronic circuit to a further electronic circuit via interconnects. A main unit implements a normal mode function of the electronic circuit. A test unit tests the interconnects. The electronic circuit has a normal mode in which the I/O nodes are logically connected to the main unit and a test mode in which the I/O nodes are logically connected to the test unit. In the test mode the test unit is operable as a low complexity memory via the I/O nodes.

Abstract: An electronic circuit comprises a plurality of input/output (I/O) nodes for connecting the electronic circuit to a further electronic circuit via interconnects. A main unit implements a normal mode function of the electronic circuit. A test unit tests the interconnects. The electronic circuit has a normal mode in which the I/O nodes are logically connected to the main unit and a test mode in which the I/O nodes are logically connected to the test unit. In the test mode the test unit is operable as a low complexity memory via the I/O nodes.

Abstract: The invention relates to a method of testing interconnections in integrated circuit (IC) assemblies. Hereto, a test signal is applied to an IC pin (110) providing an input terminal to the interconnection. In known methods, such as the boundary-scan method, a response signal is measured on an output terminal of the interconnection, provided by a further IC pin. According to the invention, however, a response signal is evaluated which is generated on the same terminal (110) as to which the test signal is applied. This has the advantage that the method of the invention can be applied when only one end of the interconnect to be tested can be supplied with appropriate test hardware. The method is particularly suited for testing a capacitance (195) between an IC pin (110) and a supply line, e.g. a ground line.

Abstract: The invention relates to a method of testing interconnections in integrated circuit (IC) assemblies. Hereto, a test signal is applied to an IC pin (110) providing an input terminal to the interconnection. In known methods, such as the boundary-scan method, a response signal is measured on an output terminal of the interconnection, provided by a further IC pin. According to the invention, however, a response signal is evaluated which is generated on the same terminal (110) as to which the test signal is applied. This has the advantage that the method of the invention can be applied when only one end of the interconnect to be tested can be supplied with appropriate test hardware. The method is particularly suited for testing a capacitance (195) between an IC pin (110) and a supply line, e.g. a ground line.

Abstract: A device which includes a first integrated circuit and a second IC for applying a fixed logic value to an input of the first integrated circuit. A conventional implementation uses pull-up and pull-down resistors, but these resistors necessitate an additional step and additional elements for the testing of the relevant interconnections. The device is improved in that an output of the second IC, which outputs the logic value during normal operation, is controlled via test logic during testing. As a result, the interconnections between the output of the second IC and the input of the first IC are tested in the same way and as part of the testing of the other interconnections between the first and second integrated circuits.

Abstract: An integrated circuit includes a sensor which is arranged in the vicinity of a conductor in the circuit and is capable of measuring the current through the conductor. This sensor, for example constructed as a coil, is capable of determining whether a connection which includes the conductor is in order. It can thus be tested notably whether the possibly multiple supply connection of the integrated circuit is appropriately connected to an external connection terminal.

Abstract: An integrated circuit includes a sensor which is arranged in the vicinity of a conductor in the circuit and is capable of measuring variations of the current through the conductor. This sensor, for example constructed as a coil, is capable of determining whether a connection which includes the conductor is in order. It can thus be tested notably whether the possibly multiple supply connection of the integrated circuit is appropriately connected to an external connection terminal.

Abstract: A testable circuit comprises a signal path having a time-dependent response behavior (for example, a high-pass filter behavior). The signal path is tested for faults. To this end, the circuit is switched to a test mode in which the signal path is isolated from other signal paths. Subsequently, a test signal containing a signal transition is applied to the input of the signal path and it is tested whether the signal on the output of the signal path at any instant exceeds a threshold level during a predetermined time interval after the transition. The result is loaded into a register and read from the circuit.

Abstract: A device which comprises an electronic circuit and at least two connections, each of which is connected to a separate output of the circuit and to a separate pulling resistor. The test resistor is connected between a fixed supply voltage and a test point with the pulling resistors connected to the test point and the electronic circuit arranged to test the connections by application of test data to the connections so that a given response is formed on the test point.

Abstract: A method as described for testing integrated circuits provided on a carrier. They comprise a series input (22) and a series output (24) for test and result patterns. A mode control register (30) is further present to receive a mode control signal train via the serial input. Under the control of said mode control signal train the serial input and output can be shortcircuited to each other, or further registers (32, 34, 36) can be selectively filled and emptied. In this manner, both the interior of the integrated circuit and respective interconnection functions can easily be tested by means of a universal protocol. Integrated circuits and the carrier only require minor extension/adaptations.

Abstract: A method for testing integrated circuits provided on a carrier. The circuits include a series input (22) and a series output (24) for test and result patterns. A mode control register (30) receives a mode control signal train via the serial input. Under the control of said mode control signal train the serial input and output can be shortcircuited to each other, or further registers (32, 34, 36) can be selectively filled and emptied. In this manner, both the interior of the integrated circuit and respective interconnection functions can easily be tested by a universal protocol. Integrated circuits and the carrier only require minor extension/adaptations.

Abstract: An electronic, digital IC module includes a substrate element on which is formed a test integrated circuit for the execution of a boundary scan on a standard integrated circuit formed on another substrate element. Either the substrate for the test circuit is provided in an electronic sub-module on which is formed a test socket, in which case the standard circuit is mounted piggy-back, or a hybrid package is provided composed of the two substrate elements which are interconnected by bond pads. The test circuit includes a shift register for parallel connection to the standard circuit and serial connection to an external test unit.