Abstract: The present invention discloses a method of testing a partially assembled multi-die device (1) by providing a carrier (300) comprising a device-level test data input (12) and a device-level test data output (18); placing a first die on the carrier, the first die having a test access port (100c) comprising a primary test data input (142), a secondary test data input (144) and a test data output (152), the test access port being controlled by a test access port controller (110); communicatively coupling the secondary test data input (144) of the first die to the device-level test data input (12), and the test data output (152) of the first die to the device-level test data output (18); providing the first die with configuration information to bring the first die in a state in which the first die accepts test instructions from its secondary test data input (144); testing the first die, said testing including providing the secondary test data input (144) of the first die with test instructions through the device-

Abstract: A sensor for contactlessly detecting currents, has a sensor element having a magnetic tunnel junction (MTJ), and detection circuitry, the sensor element having a resistance which varies with the magnetic field, and the detection circuitry is arranged to detect a tunnel current flowing through the tunnel junction. The sensor element may share an MTJ stack with memory elements. Also it can provide easy integration with next generation CMOS processes, including MRAM technology, be more compact, and use less power. Solutions for increasing sensitivity of the sensor, such as providing a flux concentrator, and for generating higher magnetic fields with a same current, such as forming L-shaped conductor elements, are given. The greater sensitivity enables less post processing to be used, to save power for applications such as mobile devices. Applications include current sensors, built-in current sensors, and IDDQ and IDDT testing, even for next generation CMOS processes.

Abstract: An integrated circuit (100) has a plurality of inputs (110) and a plurality of outputs (120). In a test mode, a test arrangement including a plurality of logic gates (140) is coupled between the plurality of inputs (110) and the plurality of outputs (120). The logic gates from the plurality of logic gates (140) have a first input coupled to an input of the plurality of inputs (110) and a further input coupled to a fixed logic value source (150). The fixed logic value source (150) is used to define an identification code of the integrated circuit (100), which can be retrieved at the plurality of outputs (120) when an appropriate bit pattern is fed to the plurality of inputs (110).

Abstract: An integrated circuit device has boundary scan structure coupled between a test input and the test output. The test register structure is used to shift information from the test input to a test output. The test shift register structure contains a data shift part coupled to connections for a functional circuit under test. In parallel with the data shift part is an instruction shift structure. By means of test control signals it is controlled whether instruction information travels from the test input to the test output through the instruction shift part or through the data shift part. The instruction shift part controls operation of the device in a test mode. A sensor is provided for sensing a physical operating parameter of the device. The sensor has an output coupled to the shift register structure for feeding a sensing result to the test output from the instruction shift part.

Abstract: A test arrangement for testing the interconnections of an electronic circuit (100) and a further electronic circuit is provided. A first selection of I/O nodes (120), which are arranged to receive input data in a functional mode of the electronic circuit (100), and which are coupled to a test unit in a test mode of the electronic circuit (100). The test unit has a combinatorial circuit (160) for implementing a multiple-input XOR or XNOR gate. The test unit also provides interconnections between the first selection of I/O nodes (120) and a second selection of I/O nodes (130) via logic gates (141–144). These interconnections increase the interconnect test coverage of the electronic device (100), because the interconnects with the further electronic circuits that are associated with I/O nodes (131–134) become testable as well.

Abstract: An integrated circuit is switchable between a normal operating mode and a test mode. A functional circuit and a test pattern converter are both coupled between input contacts, output contacts and a redefinable contact of the integrated circuit. In the test mode respectively the test pattern converter drives the outputs contacts and, dependent on the circuit configuration, the redefinable contact. The test pattern converter is arranged to provide a first and second relation between signals at the input contacts and the output contacts, with the redefinable contact used as an input or output contact respectively, dependent on the circuit configuration. The relations have been selected so as to permit testing of stuck-at and cross-connect errors with the redefinable contact used as input and output contact respectively.

Abstract: An integrated circuit assembly contains a carrier and a semi-conductor integrated circuit chip 10. A current path on the carrier supplies power to power supply connection of the chip. A magnetic field sensor is provided on the carrier in a vicinity of the current path, for sensing a magnetic field generated by a current through the current path. The assembly contains test-accessible electronic interface to the magnetic field sensor, for testing presence of the current. Preferably the sensors are integrated on the carrier by depositing magneto resistive material and patterning the material so as to provide sensors in the vicinity of current paths. Also preferably, the carrier is an interposer 12 with connecting wiring, which is packaged with one or more integrated circuit chips before mounting the interposer on a printed circuit board 19.

Abstract: Power supply connections to an integrated circuit are tested. The power supply connections are connected to a power supply conductor in the integrated circuit. For the test, combinations of current drawing circuits are switched on near the point where the power supply connection under test is connected to the power supply conductor. The current drawing circuits draw a considerable current, so as to cause a detectable voltage drop over the power supply connection, if this connection is operational. Different subsets of the current drawing circuits are activated successively. To prevent that all of the current drawing circuits are switched on at the same time by error, activation of each subset is controlled by a signal indicative of completion of activation of the preceding subset. A respective signal line is provided for each subset, to provide the signal for the subset.

Abstract: Integrated circuit with a test interface for testing a conductive connection between a supply pad and a supply of a functional block in the integrated circuit. A current test circuit has test inputs coupled to a first and a second point along the conductive connection, for comparing a voltage across the test inputs with a threshold. The current test circuit contains a threshold shifting circuit for shifting the threshold to a shifted value dependent on a voltage across the test inputs when the threshold shifting circuit is active. Testing is executed in two steps, making the threshold shifting circuit active when a first voltage is applied across test inputs and comparing a second voltage at the test input with the shifted threshold. One of the first and second voltage is a voltage drop across the connection when the integrated circuit is set to draw current along a connection, the other one of the first and second voltage is a reference voltage.

Abstract: An integrated circuit is switchable between a normal operating mode and a test mode. A functional circuit and a test pattern converter are both coupled between input contacts, output contacts and a redefinable contact of the integrated circuit. In the test mode respectively the test pattern converter drives the outputs contacts and, dependent on the circuit configuration, the redefinable contact. The test pattern converter is arranged to provide a first and second relation between signals at the input contacts and the output contacts, with the redefinable contact used as an input or output contact respectively, dependent on the circuit configuration. The relations have been selected so as to permit testing of stuck-at and cross-connect errors with the redefinable contact used as input and output contact respectively.

Abstract: An integrated circuit assembly contains a carrier and a semi-conductor integrated circuit chip 10. A current path on the carrier supplies power to power supply connection of the chip. A magnetic field sensor is provided on the carrier in a vicinity of the current path, for sensing a magnetic field generated by a current through the current path. The assembly contains test-accessible electronic interface to the magnetic field sensor, for testing presence of the current. Preferably the sensors are integrated on the carrier by depositing magneto resistive material and patterning the material so as to provide sensors in the vicinity of current paths. Also preferably, the carrier is an interposer 12 with connecting wiring, which is packaged with one or more integrated circuit chips before mounting the interposer on a printed circuit board 19.

Abstract: Power supply connections to an integrated circuit are tested. The power supply connections are connected to a power supply conductor in the integrated circuit. For the test, combinations of current drawing circuits are switched on near the point where the power supply connection under test is connected to the power supply conductor. The current drawing circuits draw a considerable current, so as to cause a detectable voltage drop over the power supply connection, if this connection is operational. Different subsets of the current drawing circuits are activated successively. To prevent that all of the current drawing circuits are switched on at the same time by error, activation of each subset is controlled by a signal indicative of completion of activation of the preceding subset. A respective signal line is provided for each subset, to provide the signal for the subset.

Abstract: Integrated circuit with a test interface for testing a conductive connection between a supply pad and a supply of a functional block in the integrated circuit. A current test circuit has test inputs coupled to a first and a second point along the conductive connection, for comparing a voltage across the test inputs with a threshold. The current test circuit contains a threshold shifting circuit for shifting the threshold to a shifted value dependent on a voltage across the test inputs when the threshold shifting circuit is active. Testing is executed in two steps, making the threshold shifting circuit active when a first voltage is applied across test inputs and comparing a second voltage at the test input with the shifted threshold. One of the first and second voltage is a voltage drop across the connection when the integrated circuit is set to draw current along said connection, the other one of the first and second voltage is a reference voltage.