Patents by Inventor Franck Dosseul

Franck Dosseul has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10454075
    Abstract: An electronic device includes a flexible conductive member having a first length, and a battery substrate having a second length shorter or equal than the first length. There is an active battery on the battery substrate. An adhesive layer couples the active battery and the battery substrate to the flexible conductive member such that the active battery and the flexible conductive member are electrically coupled, and such that the flexible substrate encapsulates the active battery and the upper portion of the battery substrate without an intervening layer. The flexible conductive member includes an insulating flexible base layer having a conductive via formed therein. Upper and lower metallized layers are formed on the insulating flexible base layer and are electrically coupled to one another by the conductive via.
    Type: Grant
    Filed: February 9, 2018
    Date of Patent: October 22, 2019
    Assignee: STMicroelectronics (Tours) SAS
    Inventors: Alexis Durand, Franck Dosseul
  • Publication number: 20180166659
    Abstract: An electronic device includes a flexible conductive member having a first length, and a battery substrate having a second length shorter or equal than the first length. There is an active battery on the battery substrate. An adhesive layer couples the active battery and the battery substrate to the flexible conductive member such that the active battery and the flexible conductive member are electrically coupled, and such that the flexible substrate encapsulates the active battery and the upper portion of the battery substrate without an intervening layer. The flexible conductive member includes an insulating flexible base layer having a conductive via formed therein. Upper and lower metallized layers are formed on the insulating flexible base layer and are electrically coupled to one another by the conductive via.
    Type: Application
    Filed: February 9, 2018
    Publication date: June 14, 2018
    Applicant: STMicroelectronics (Tours) SAS
    Inventors: Alexis Durand, Franck Dosseul
  • Patent number: 9923176
    Abstract: An electronic device includes a flexible conductive member having a first length, and a battery substrate having a second length shorter or equal than the first length. There is an active battery on the battery substrate. An adhesive layer couples the active battery and the battery substrate to the flexible conductive member such that the active battery and the flexible conductive member are electrically coupled, and such that the flexible substrate encapsulates the active battery and the upper portion of the battery substrate without an intervening layer. The flexible conductive member includes an insulating flexible base layer having a conductive via formed therein. Upper and lower metallized layers are formed on the insulating flexible base layer and are electrically coupled to one another by the conductive via.
    Type: Grant
    Filed: April 8, 2015
    Date of Patent: March 20, 2018
    Assignee: STMicroelectronics (Tours) SAS
    Inventors: Alexis Durand, Franck Dosseul
  • Publication number: 20160301037
    Abstract: An electronic device includes a flexible conductive member having a first length, and a battery substrate having a second length shorter or equal than the first length. There is an active battery on the battery substrate. An adhesive layer couples the active battery and the battery substrate to the flexible conductive member such that the active battery and the flexible conductive member are electrically coupled, and such that the flexible substrate encapsulates the active battery and the upper portion of the battery substrate without an intervening layer. The flexible conductive member includes an insulating flexible base layer having a conductive via formed therein. Upper and lower metallized layers are formed on the insulating flexible base layer and are electrically coupled to one another by the conductive via.
    Type: Application
    Filed: April 8, 2015
    Publication date: October 13, 2016
    Applicant: STMicroelectronics (Tours) SAS
    Inventors: Alexis Durand, Franck Dosseul
  • Publication number: 20070020909
    Abstract: A method for forming conductive bumps on conductive pads formed on an electronic circuit wafer, comprising the steps of: including forming a resist mask with holes above the pads; depositing balls in the holes; performing a thermal processing to melt the balls; and eliminating the mask.
    Type: Application
    Filed: July 24, 2006
    Publication date: January 25, 2007
    Applicant: STMicroelectronics S.A.
    Inventor: Franck Dosseul