Abstract: A method for realizing a dual interface IC card includes arranging a plastic support having a hole or a recess for housing a micro module, and housing in the IC card an antenna having at least one first and one second terminal or pad for connection to the micro module arranged in the recess. The method also includes distributing a soldering paste on the at least one first and one second pad, so as to form a first and a second contact conductive bump with electric connection contacts of the micro module, and distributing, along the whole perimeter of the micro module or of the recess, a layer of non conductive glue. The method further includes positioning the micro module in the recess with the contacts axially aligned to the terminal of the antenna, and executing a reflow of the soldering paste to form the first and second conductive bump.

Abstract: A method for realizing a dual interface IC card includes arranging a plastic support having a hole or a recess for housing a micro module, and housing in the IC card an antenna having at least one first and one second terminal or pad for connection to the micro module arranged in the recess. The method also includes distributing a soldering paste on the at least one first and one second pad, so as to form a first and a second contact conductive bump with electric connection contacts of the micro module, and distributing, along the whole perimeter of the micro module or of the recess, a layer of non conductive glue. The method further includes positioning the micro module in the recess with the contacts axially aligned to the terminal of the antenna, and executing a reflow of the soldering paste to form the first and second conductive bump.