Abstract: A balancing/unbalancing (balun) structure includes a microstrip line printed circuit board (PCB). Two input ports are coupled to a differential signal. An isolated port is connected to ground through a resistance. An output port is coupled to a single-ended signal corresponding to the differential signal. A plurality of traces on the PCB connect the two input ports, the load connection port and the output port, wherein distance between adjacent traces is approximately twice PCB thickness.

Abstract: A system includes a support device and an elongated spiral antenna coupled to the support device. The elongated spiral antenna has a contracted portion and an expanded portion. The expanded portion provides beam steering and directivity. The system also includes a feed line coupled to the elongated spiral antenna. A method for forming the elongated spiral antenna uses a predetermined formula to form arms of the elongated spiral antenna. The arms can be formed by printing the arms on a printed circuit board.

Abstract: Systems and methods are provided that facilitate the formation of micro-mechanical structures and related systems on a laminated substrate. More particularly, a micro-mechanical device and a three-dimensional multiple frequency antenna are provided for in which the micro-mechanical device and antenna, as well as additional components, can be fabricated together concurrently on the same laminated substrate. The fabrication process includes a low temperature deposition process allowing for deposition of an insulator material at a temperature below the maximum operating temperature of the laminated substrate, as well as a planarization process allowing for the molding and planarizing of a polymer layer to be used as a form for a micro-mechanical device.

Abstract: A system includes a support device and an elongated spiral antenna coupled to the support device. The elongated spiral antenna has a contracted portion and an expanded portion. The expanded portion provides beam steering and directivity. The system also includes a feed line coupled to the elongated spiral antenna. A method for forming the elongated spiral antenna uses a predetermined formula to form arms of the elongated spiral antenna. The arms can be formed by printing the arms on a printed circuit board.

Abstract: A balancing/unbalancing (balun) structure for operating at frequency f1 includes a microstrip printed circuit board (PCB). A balun on the PCB includes two input ports are coupled to a differential signal. An isolated port is connected to ground through a matched resistance. An output port is coupled to a single-ended signal corresponding to the differential signal. A plurality of traces on the PCB connect the two input ports, the load connection port and a tap point to the output port. A f2 rejection filter on the PCB is wrapped around the balun and includes a first folded element with a transmission length of &lgr;2/4 and connected to the output port. A second folded element has a transmission length of &lgr;2/4 and connected to the tap point. A third folded element connects the tap point to the output port and has a transmission length of &lgr;2/4.

Abstract: A signal sensing module senses an RF signal and produces one or more secondary signals representative of the RF signal. An impedance matching control module generates a control signal, based on the one or more secondary signals, which is indicative of an impedance mismatch between a load and a communications device. The control signal is then applied to at least one variable impedance device to adjust the impedance of an impedance matching network and thereby reduce the impedance mismatch between the load and the communications device. In an embodiment, the at least one variable impedance device is a barium strontium titanate, thin film, parallel plate capacitor. In other embodiments, other variable impedance devices such as other types of thin film capacitors or varactor diodes are used to adjust the impedance of the impedance matching network.

Abstract: A balancing/unbalancing (balun) structure for operating at frequency f1 includes a microstrip printed circuit board (PCB). A balun on the PCB includes two input ports are coupled to a differential signal. An isolated port is connected to ground through a matched resistance. An output port is coupled to a single-ended signal corresponding to the differential signal. A plurality of traces on the PCB connect the two input ports, the load connection port and a tap point to the output port. A f2 rejection filter on the PCB is wrapped around the balun and includes a first folded element with a transmission length of &lgr;2/4 and connected to the output port. A second folded element has a transmission length of &lgr;2/4 and connected to the tap point.

Abstract: A system includes a support device and an elongated spiral antenna coupled to the support device. The elongated spiral antenna has a contracted portion and an expanded portion. The expanded portion provides beam steering and directivity. The system also includes a feed line coupled to the elongated spiral antenna. A method for forming the elongated spiral antenna uses a predetermined formula to form arms of the elongated spiral antenna. The arms can be formed by printing the arms on a printed circuit board.

Abstract: A balancing/unbalancing (balun) structure includes a microstrip line printed circuit board (PCB). Two input ports are coupled to a differential signal. An isolated port is connected to ground through a resistance. An output port is coupled to a single-ended signal corresponding to the differential signal. A plurality of traces on the PCB connect the two input ports, the load connection port and the output port, wherein distance between adjacent traces is approximately twice PCB thickness.

Abstract: A balancing/unbalancing (balun) structure for operating at frequency f1 includes a microstrip printed circuit board (PCB). A balun on the PCB includes two input ports are coupled to a differential signal. An isolated port is connected to ground through a matched resistance. An output port is coupled to a single-ended signal corresponding to the differential signal. A plurality of traces on the PCB connect the two input ports, the load connection port and a tap point to the output port. A f2 rejection filter on the PCB is wrapped around the balun and includes a first folded element with a transmission length of &lgr;2/4 and connected to the output port. A second folded element has a transmission length of &lgr;2/4 and connected to the tap point. A third folded element connects the tap point to the output port and has a transmission length of &lgr;2/4.

Abstract: A signal sensing module senses an RF signal and produces one or more secondary signals representative of the RF signal. An impedance matching control module generates a control signal, based on the one or more secondary signals, which is indicative of an impedance mismatch between a load and a communications device. The control signal is then applied to at least one variable impedance device to adjust the impedance of an impedance matching network and thereby reduce the impedance mismatch between the load and the communications device. In an embodiment, the at least one variable impedance device is a barium strontium titanate, thin film, parallel plate capacitor. In other embodiments, other variable impedance devices such as other types of thin film capacitors or varactor diodes are used to adjust the impedance of the impedance matching network.

Abstract: A signal sensing module senses an RF signal and produces one or more secondary signals representative of the RF signal. An impedance matching control module generates a control signal, based on the one or more secondary signals, which is indicative of an impedance mismatch between a load and a communications device. The control signal is then applied to at least one variable impedance device to adjust the impedance of an impedance matching network and thereby reduce the impedance mismatch between the load and the communications device. In an embodiment, the at least one variable impedance device is a barium strontium titanate, thin film, parallel plate capacitor. In other embodiments, other variable impedance devices such as other types of thin film capacitors or varactor diodes are be used to adjust the impedance of the impedance matching network.