Patents by Inventor Franco Marconi

Franco Marconi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9647313
    Abstract: The invention relates to a surface mount microwave system, comprising a multilayer arrangement comprising a first conductive layer, a second conductive layer and a dielectric layer, wherein the first conductive layer is arranged on the dielectric layer, and wherein the dielectric layer is arranged on the second conductive layer, wherein the first conductive layer comprises a microwave circuit and wherein the second conductive layer forms a reference potential layer, a hollow microwave waveguide being at least partly formed in the second conductive layer, and a microwave transition structure for electromagnetically coupling the first conductive layer with the hollow microwave waveguide. According to some implementation forms, a reflector on a cover covering the multilayer arrangement may be avoided.
    Type: Grant
    Filed: July 18, 2014
    Date of Patent: May 9, 2017
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Franco Marconi, Fabio Morgia, Haiou Gou, Stefano Verzura, Guoyu Su
  • Publication number: 20150102870
    Abstract: A directional coupler arrangement comprising an air waveguide and a coupler port having a coupler line arranged inside the air waveguide. A method for producing a directional coupler arrangement comprising forming an air waveguide and forming a coupler port having a coupler line arranged inside the air waveguide is also disclosed.
    Type: Application
    Filed: December 15, 2014
    Publication date: April 16, 2015
    Inventors: Guoyu SU, Fabio MORGIA, Franco MARCONI
  • Patent number: 8988891
    Abstract: Embodiments of the present invention provide a micro and millimeter waves circuit, including: a multi-layer circuit board, a heat substrate, and a circuit module. The multi-layer circuit board is opened with a window. The heat substrate includes a base. The multi-layer circuit board is attached to the base. The heat substrate further includes a projecting part extending from the base into the window of the multi-layer circuit board. The circuit module is received in the window and placed on the projecting part. The circuit module is electrically connected with an outer conductor layer of the multi-layer circuit board.
    Type: Grant
    Filed: May 23, 2012
    Date of Patent: March 24, 2015
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Bing Luo, Franco Marconi
  • Publication number: 20140327490
    Abstract: The invention relates to a surface mount microwave system, comprising a multilayer arrangement (101) comprising a first conductive layer (103), a second conductive layer (105) and a dielectric layer (107), wherein the first conductive layer (103) is arranged on the dielectric layer (107), and wherein the dielectric layer (107) is arranged on the second conductive layer (105), wherein the first conductive layer (103) comprises a microwave circuit (109) and wherein the second conductive layer (105) forms a reference potential layer, a hollow microwave waveguide (111) being at least partly formed in the second conductive layer (105), and a microwave transition structure (113) for electromagnetically coupling the first conductive layer (103) with the hollow microwave waveguide (111). According to some implementation forms, a reflector on a cover covering the multilayer arrangement (101) may be avoided.
    Type: Application
    Filed: July 18, 2014
    Publication date: November 6, 2014
    Inventors: Franco MARCONI, Fabio MORGIA, Haiou GOU, Stefano VERZURA, Guoyu SU
  • Publication number: 20120243185
    Abstract: Embodiments of the present invention provide a micro and millimeter waves circuit, including: a multi-layer circuit board, a heat substrate, and a circuit module. The multi-layer circuit board is opened with a window. The heat substrate includes a base. The multi-layer circuit board is attached to the base. The heat substrate further includes a projecting part extending from the base into the window of the multi-layer circuit board. The circuit module is received in the window and placed on the projecting part. The circuit module is electrically connected with an outer conductor layer of the multi-layer circuit board.
    Type: Application
    Filed: May 23, 2012
    Publication date: September 27, 2012
    Applicant: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Bing LUO, Franco MARCONI
  • Patent number: 5012210
    Abstract: A comb-line band-pass filter with circular cross section is made up of internal rods constituting the resonators of the filter and brought to resonance by the use of tuning screws and alternating with coupling screws. In the filter the rods are inserted in such a manner that each one is rotated in relation to the preceding one by an angle of 0.degree.<.alpha.<90.degree. while the coupling screws are placed at an intermediate angle. For equal electrical characteristics the length of the filter is also a function of the rotation angle of the rods.
    Type: Grant
    Filed: December 5, 1989
    Date of Patent: April 30, 1991
    Assignee: Siemens Telecomunicazioni S.p.A.
    Inventors: Franco Marconi, Nicolo De Stena
  • Patent number: 4978933
    Abstract: To an output terminal of a hybrid circuit with output signals mutually phase shifted 90 degrees is connected a half-wave line section while to the second output terminal is connected a low attenuation filtering network having a phase characteristic which is -90 degrees at the center frequency and varies with the frequency like a half-wave line section.
    Type: Grant
    Filed: September 29, 1988
    Date of Patent: December 18, 1990
    Assignee: Siemens Telecommunicazioni S.p.A.
    Inventor: Franco Marconi
  • Patent number: 4754240
    Abstract: A pin diode variable attenuator featuring decouping values higher than those achievable using the technique used so far, is described. This result has been achieved by implementing the line sections which the pin diodes are connected to with a characteristic impedance different than the characteristic impedance input and output to/from the attenuator.
    Type: Grant
    Filed: November 6, 1986
    Date of Patent: June 28, 1988
    Assignee: GTE Telecomunicazioni, S.p.A.
    Inventor: Franco Marconi