Patents by Inventor Francois Arguin

Francois Arguin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High-density chip-to-chip interconnection with silicon bridge
    Patent number: 10784202
    Abstract: A package and system for high-density chip-to-chip interconnection is provided. Embodiments of the present invention utilizes a plurality of circuit dies including a laminate substrate adjacent to the plurality of circuit dies. It also includes a conductive spacer disposed between the laminate substrate and one of the plurality of circuit dies, a silicon bridge and a conductive interposer disposed between the laminate substrate and the plurality of dies and adjacent to the conductive spacer. Furthermore the embodiment of this present invention can include a top layer of a printed circuit board (PCB) coupled with a bottom layer of the laminate substrate. The conductive spacer comprises, at least of, a laminate, organic or copper material.
    Type: Grant
    Filed: December 1, 2017
    Date of Patent: September 22, 2020
    Assignee: International Business Machines Corporation
    Inventors: Francois Arguin, Luc Guerin, Maryse Cournoyer, Steve E. Whitehead, Jean Audet, Richard D. Langlois, Christian Bergeron, Pascale Gagnon, Nathalie Meunier
  • HIGH-DENSITY CHIP-TO-CHIP INTERCONNECTION WITH SILICON BRIDGE
    Publication number: 20190172787
    Abstract: A package and system for high-density chip-to-chip interconnection is provided. Embodiments of the present invention utilizes a plurality of circuit dies including a laminate substrate adjacent to the plurality of circuit dies. It also includes a conductive spacer disposed between the laminate substrate and one of the plurality of circuit dies, a silicon bridge and a conductive interposer disposed between the laminate substrate and the plurality of dies and adjacent to the conductive spacer. Furthermore the embodiment of this present invention can include a top layer of a printed circuit board (PCB) coupled with a bottom layer of the laminate substrate. The conductive spacer comprises, at least of, a laminate, organic or copper material.
    Type: Application
    Filed: December 1, 2017
    Publication date: June 6, 2019
    Inventors: Francois Arguin, Luc Guerin, Maryse Cournoyer, Steve E. Whitehead, Jean Audet, Richard D. Langlois, Christian Bergeron, Pascale Gagnon, Nathalie Meunier