Abstract: An optical component to be mounted on a transfer surface. At least one face of the optical component includes at least one metallized bonding land arranged in a notch for assembly by transfer of the component and soldering of metallized bonding lands on the transfer surface.

Abstract: A method for producing a chip-scale electronic package produced at a substrate level, the substrate including at least one chip having input/output pads on a substrate face. The method a) forms, using a complex mold or stencil, an insulating stress relaxation layer on the front face, the relaxation layer covering the front face of the substrate with a surface relief that provides access wells at input/output pads and protruding parts configured to relax stresses, with each protruding part having a tiered shape including at least one protuberant zone and at least one zone that is recessed in relation to the protuberant zone and is configured to support an electrical bonding pad, b) forms electrically conductive tracks on the relaxation layer to connect input/output pads to the corresponding electrical bonding pads, and c) forms electrical contacts with an exterior on electrical bonding pads.

Abstract: The invention relates to a frequency filter comprising a structure with, on one face, two extreme evanescent areas and at least one wave guide area between the evanescent areas, characterised in that the at least one wave guide area and the evanescent areas form a single closed cavity, the said single cavity being partitioned by at least two resonator elements that are embedded in the said single cavity at placement areas and that contribute to delimiting the said at least one wave guide area and the evanescent areas. The invention also relates to a process for manufacturing at least one such frequency filter, the said process comprising the following steps: manufacture of a structure comprising at least one cavity on one of its faces, called the back face, embedment of at least two resonator elements in the cavity at placement areas so as to delimit the at least one wave guide area and the evanescent areas.

Abstract: The invention relates to a method for making an anisotropic conductive film with pointed conductive inserts. The method comprises the etching of at least one pattern (C1, K1) in a single crystal substrate (15) in order to form at least one cell (22, 26) with a bottom intended for drawing the contour of an end of an insert (23, 27). The drawing of the pattern is for having at least one protruding tip appear in the bottom of the cell during the etching of the pattern along the (100) crystallographic plane of the substrate with limiting (111) or (110) planes of the pattern. The invention is applied to microconnector technology.

Abstract: A structure including a sequence of elements for sending or receiving a signal along an axis. Two successive elements along the direction of the axis are offset with respect to each other along the direction perpendicular to the axis. The structure includes at least two layers of material deposited on a reception substrate using the layer transfer technique. The structure particularly relates to any type of structure for which elements must have a high density, such as a print bead, networks of optical components, antenna networks, etc.

Abstract: The invention relates to a test socket (10) for an electronic component, comprising a embossed support layer (12) comprising several embossments (16) with projecting relief, the embossments being provided with at least one conducting test area (14) near the top of the embossment, that may be brought into electrical contact with a terminal of the component. Application to testing bare or packaged electronic components.

Abstract: The invention relates to a test socket (10) for an electronic component, comprising a embossed support layer (12) comprising several embossments (16) with projecting relief, the embossments being provided with at least one conducting test area (14) near the top of the embossment, that may be brought into electrical contact with a terminal of the component.

Abstract: The invention relates to a structure comprising a sequence of elements (t) for sending or receiving a signal along an axis. Two successive elements (t) along the direction of the axis are offset with respect to each other along the direction perpendicular to the axis. The structure comprises at least two layers of material (K1, K2) deposited on a reception substrate (S1) using the layer transfer technique.

Abstract: The invention relates to a system comprising a first substrate (100) with at least one bonding area (110a, 110b), liable to be assembled with a second substrate (200), the bonding area (110a, 110b) comprising an area made of a material (104) that can be wetted with a meltable material. According to the invention, the bonding area (110a, 110b) comprises at least one cavity (120) to receive meltable material.