Abstract: A superposed wafer is separated to a processing target wafer and a supporting wafer while being heated. Then, an adhesive on a joint surface of the processing target wafer is removed by supplying an organic solvent onto the joint surface of the processing target wafer. Then, an oxide film formed on the predetermined pattern on the joint surface of the processing target wafer is removed by supplying acetic acid to the joint surface of the processing target wafer. Then, the joint surface of the processing target wafer is inspected. Then, based on an inspection result, the adhesive on the joint surface of the processing target wafer is removed and the oxide film formed on the predetermined pattern on the joint surface of the processing target wafer is removed.

Abstract: A method includes: a first step of disposing the superposed substrate at a position where the superposed substrate is not in contact with a first holding unit and a second holding unit in a space between the first holding unit and the second holding unit, and supplying an inert gas into the space; a second step of thereafter relatively moving the first holding unit and the second holding unit in the vertical direction, and holding the processing target substrate by the first holding unit and holding the supporting substrate by the second holding unit; and a third step of thereafter relatively moving the first holding unit and the second holding unit in the horizontal direction while heating the processing target substrate held by the first holding unit and the supporting substrate held by the second holding unit, to separate the processing target substrate and the supporting substrate from each other.

Abstract: A peeling device for peeling off a substrate to be processed and a support substrate from an overlapped substrate, the overlapped substrate being formed by bonding the substrate to be processed and the support substrate by an adhesive, which includes: a first holding unit configured to heat the substrate to be processed and configured to hold the substrate to be processed; a second holding unit configured to heat the support substrate and configured to hold the support substrate; a moving mechanism configured to horizontally move at least one of the first holding unit and the second holding unit relative to each other; and an inert gas supply mechanism configured to supply an inert gas onto a bonding surface of the substrate to be processed or a bonding surface of the support substrate.

Abstract: A separation apparatus for separating a superposed substrate in which a processing target substrate and a supporting substrate are joined together with an adhesive, into the processing target substrate and the supporting substrate includes: a first holding unit that includes a heating mechanism heating the processing target substrate and holds the processing target substrate; a second holding unit that includes a heating mechanism heating the supporting substrate and holds the supporting substrate; a moving mechanism that relatively moves at least the first holding unit or the second holding unit in a horizontal direction; and a porous part that is annularly provided along an outer peripheral portion of the first holding unit and formed with a plurality of pores, and supplies an inert gas to the outer peripheral portion of the first holding unit holding the processing target substrate.

Abstract: Disclosed is a substrate conveyance apparatus capable of suppressing a substrate from being damaged. The substrate conveyance apparatus includes a plurality of nozzles, and a main body unit. The plurality of nozzles are configured to jet a gas toward a surface of a substrate to hold the substrate in a non-contact manner. The main body unit is provided with the plurality of nozzles. At least surfaces of the plurality of nozzles are formed of a resin.

Abstract: A method of detecting stack overflows includes the following steps: storing in at least one dedicated register at least one data item chosen from: a data item (SPHaut) indicating a maximum permitted value for a stack pointer, and a data item (SPBas) indicating a minimum permitted value for said stack pointer; effecting a comparison between a current value (SP) or past value (SPMin, SPMax) of said stack pointer and said data item or each of said data items; and generating a stack overflow exception if said comparison indicates that said current or past value of said stack pointer is greater than said maximum permitted value or less than said minimum permitted value. A processor for implementing such a method is also provided.

Abstract: A method of detecting stack overflows includes the following steps: storing in at least one dedicated register at least one data item chosen from: a data item (SPHaut) indicating a maximum permitted value for a stack pointer, and a data item (SPBas) indicating a minimum permitted value for said stack pointer; effecting a comparison between a current value (SP) or past value (SPMin, SPMax) of said stack pointer and said data item or each of said data items; and generating a stack overflow exception if said comparison indicates that said current or past value of said stack pointer is greater than said maximum permitted value or less than said minimum permitted value. A processor for implementing such a method is also provided.

Abstract: This invention is in the field of lymphadenopathy virus, which has been designated Human Immunodeficiency Virus Type 1 (HIV-1) to detect the presence of DNA, RNA or antibodies of the lymphadenopathy retrovirus associated with the acquired immune deficiency syndrome or of the lymphadenopathy syndrome by the use of DNA fragments or the peptides encoded by said DNA fragments. The invention further relates tot he DNA fragments, vectors comprising them and the proteins expressed.

Abstract: This invention is in the field of lymphadenopathy virus, which has been designated Human Immunodeficiency Virus Type 1 (HIV-1). This invention relates to a diagnostic means and method to detect the presence of DNA, RNA or antibodies of the lymphadenopathy retrovirus associated with the acquired immune deficiency syndrome or of the lymphadenopathy syndrome by the use of DNA fragments or the peptides encoded by said DNA fragments. The invention further relates to the DNA fragments, vectors comprising them and the proteins expressed.

Abstract: This invention is in the field of lymphadenopathy virus which has been designated Human Immunodeficiency Virus Type 1 (HIV-1). This invention relates to a diagnostic means and method to detect the presence of DNA, RNA or antibodies of the lymphadenopathy retrovirus associated with the acquired immune deficiency syndrome or of the lymphadenopathy syndrome by the use of DNA fragments or the peptides encoded by said DNA fragments. The invention further relates to the DNA fragments, vectors comprising them and the proteins expressed.

Abstract: Fuel vapors leaving the fuel tank of a motor vehicle are recovered with a filter cartridge inserted between the tank and the intake manifold of the engine. An atmospheric connection duct of the cartridge can be selectively connected to the intake partial vacuum with a pneumatic distributor. The leaktightness of the device is thereby tested.