Abstract: Described herein is a low molecular weight fluorinated (meth)acrylate polymer comprising a plurality of pendent sulfonylamide groups, which is used as a tackifier in a pressure sensitive adhesive composition. Also described herein is a pressure sensitive adhesive composition comprising the low molecular weight fluorinated (meth)acrylate polymer, and articles comprising the pressure sensitive adhesive composition. The pressure sensitive adhesive preferably also comprises a high molecular weight polymer, which is derived from a (meth)acrylate monomer or is a fluoropolymer.

Abstract: Described herein is a pressure sensitive adhesive is comprising: (a) a high molecular weight (meth)acrylate polymer wherein the high molecular weight (meth)acrylate polymer is derived from (i) a C4 to C24 (meth)acrylate ester monomer; and (ii) 0 to less than 10 wt % of a polar comonomer based on the weight of the high molecular weight (meth)acrylate polymer; and (b) 10 to 100 parts of a low molecular weight fluorinated polymer per 100 parts of the high molecular weight (meth)acrylate polymer, wherein the low molecular weight fluorinated polymer has a glass transition temperature (Tg) of less than 40° C. The low molecular weight fluorinated polymer is preferably derived from fluorinated (meth)acrylate, fluorinated (meth)acrylate comprising a sulfonylamide group, fluorinated vinyl monomers, fluorinated vinyl ethers, or fluorinated styrene.

Abstract: Ionizing radiation crosslinkable pressure sensitive adhesive precursors containing hydrocarbon tackifiers and having an acid content of no more than 3% by weight. The precursors can be exposed to a source of ionizing radiation, for example, one or both of an electron beam or gamma radiation, for an exposure time sufficient to receive an energy dose sufficient to at least partially crosslink the adhesive precursor, thereby forming a pressure sensitive adhesive. Methods of using ionizing radiation to crosslink a crosslinkable pressure sensitive adhesive precursor are also disclosed.

Abstract: Described herein is a pressure sensitive adhesive comprising a high molecular weight fluorinated polymer having a Tg less than about 0° C. and a number average molecular weight greater than about 20 kilograms/mole; and a low molecular weight fluorinated polymer derived from an ethylenically unsaturated fluorinated monomer, wherein the low molecular weight fluorinated polymer has a Tg greater than about ?15° C. and a number average molecular weight less than about 18 kilograms/mole. Also described herein are articles comprising the pressure sensitive adhesive composition.

Abstract: The present invention relates to a radiation crosslinkable pressure sensitive adhesive precursor comprising: a) an acrylate base polymer; b) a co-polymerized type (II) photocrosslinker, in a amount greater than 0.05 parts by weight per 100 parts by weight of acrylate base polymer; c) a co-polymerized hydrogen-donating monomer; and d) a tackifying resin, in an amount greater than 40 parts by weight per 100 parts by weight of acrylate base polymer. The present invention is also directed to a method of preparing a radiation crosslinked pressure sensitive adhesive.

Abstract: Crosslinkable pressure sensitive adhesive precursors containing hydrocarbon tackifiers can have content of no more than 3%, and can be crosslinked to provide pressure sensitive adhesives.

Abstract: The present invention relates to a radiation crosslinkable pressure sensitive adhesive precursor comprising: a) an acrylate base polymer; b) a co-polymerized type (II) photocrosslinker, in a amount greater than 0.05 parts by weight per 100 parts by weight of acrylate base polymer; c) a co-polymerized hydrogen-donating monomer; and d) a tackifying resin, in an amount greater than 40 parts by weight per 100 parts by weight of acrylate base polymer. The present invention is also directed to a method of preparing a radiation crosslinked pressure sensitive adhesive.

Abstract: The present invention relates to a radiation crosslinkable pressure sensitive adhesive precursor comprising: a) an acrylate base polymer; b) a co-polymerized type (II) photocrosslinker, in a amount greater than 0.05 parts by weight per 100 parts by weight of acrylate base polymer; c) a co-polymerized hydrogen-donating monomer; and d) a tackifying resin, in an amount greater than 40 parts by weight per 100 parts by weight of acrylate base polymer. The present invention is also directed to a method of preparing a radiation crosslinked pressure sensitive adhesive.

Abstract: Pressure-sensitive adhesive compositions and articles containing the pressure-sensitive adhesives are provided. The pressure-sensitive adhesives contain an (meth)acrylic-based elastomeric material prepared an alkyl (meth)acrylate having an alkyl groups that is branched and that contains at least 14 carbon atoms.

Abstract: The present invention relates to a radiation crosslinkable pressure sensitive adhesive precursor comprising: a) an acrylate base polymer; b) a co-polymerized type (II) photocrosslinker, in a amount greater than 0.05 parts by weight per 100 parts by weight of acrylate base polymer; c) a co-polymerized hydrogen-donating monomer; and d) a tackifying resin, in an amount greater than 40 parts by weight per 100 parts by weight of acrylate base polymer. The present invention is also directed to a method of preparing a radiation crosslinked pressure sensitive adhesive.

Abstract: Pressure-sensitive adhesive compositions and articles containing the pressure-sensitive adhesives are provided. The pressure-sensitive adhesives contain an (meth)acrylic-based elastomeric material prepared an alkyl (meth)acrylate having an alkyl groups that is branched and that contains at least 14 carbon atoms.

Abstract: Pressure sensitive adhesives containing a cyclic phosphonate ester are described. Methods of preparing such adhesives and articles comprising such adhesives are also described.

Abstract: A cured adhesive composition comprising: (a) a copolymer comprising the reaction product of: 65 to 94.5 wt % of a C?8#191 acrylate ester, 0.5 to 5 wt % of a polar cross-linkable monomer, and 5-30 wt % of a non polar monomer, wherein the copolymer has a weight average molecular weight of 400,000 to 2,200,000 grains/mole; (b) 30 to 70 parts of a hydrogenated hydrocarbon tackifier per 100 parts of the copolymer; and (c) 0.01 to 3 parts (solid/solid) of a cross-linking agent per 100 parts of the copolymer wherein the cured adhesive has a peel value greater than 6 N/cm when tested according to FINAT test method No. 2 on a low density polyethylene; and further wherein the cured adhesive has a shear value greater than 2000 minutes when tested according to FINAT test method No. 8 on low density polyethylene. The cured adhesive of this disclosure is found to exhibit excellent adhesion to low surface energy substrates.

Abstract: Fluorinated polymeric microparticles, processes for preparing them and uses thereof as additives for fluid loss control of drilling fluids and methods of fluid loss control of drilling fluid loss with fluorinated microparticles and uses of fluoropolymers as fluid loss control agents. Said fluorinated polymeric microparticles comprise one or more repeating units derived from one or more fluorinated monomers and one or more repeating units derived from one or more acrylate monomers.

Abstract: Hot-melt processable adhesive, such as pressure-sensitive-adhesive (PSA) or heat-activatable adhesive, compositions of the present invention possess a broad formulation latitude and adequate cohesive strength after application for use in high performance applications. Hot-melt processable adhesives of the invention comprise at least one block copolymer comprising at least two A blocks and at least one B block. The A and B blocks are derived from monoethylenically unsaturated monomers, which monomers result in saturated polymer backbones without the need for subsequent hydrogenation upon their polymerization. Preferably, the block copolymer is a (meth)acrylate block copolymer.

Abstract: Described are melt-processable block copolymers and compositions, embodiments of which may be useful in applications such as pressure sensitive adhesive (PSA) or heat-activatable adhesive, comprising polymeric end block and polymeric B block, wherein end block comprises copolymer and the B block comprises homopolymer or copolymer.

Abstract: Hot-melt processable adhesive, such as pressure-sensitive-adhesive (PSA) or heat-activatable adhesive, compositions of the present invention possess a broad formulation latitude and adequate cohesive strength after application for use in high performance applications. Hot-melt processable adhesives of the invention comprise at least one block copolymer comprising at least two A blocks and at least one B block. The A and B blocks are derived from monoethylenically unsaturated monomers, which monomers result in saturated polymer backbones without the need for subsequent hydrogenation upon their polymerization. Preferably, the block copolymer is a (meth)acrylate block copolymer.

Abstract: Described are melt-processable block copolymers and compositions, embodiments of which may be useful in applications such as pressure sensitive adhesive (PSA) or heat-activatable adhesive, comprising polymeric end block and polymeric B block, wherein end block comprises copolymer and the B block comprises homopolymer or copolymer.

Abstract: Hot-melt processable adhesive, such as pressure-sensitive-adhesive (PSA) or heat-activatable adhesive, compositions of the present invention possess a broad formulation latitude and adequate cohesive strength after application for use in high performance applications. Hot-melt processable adhesives of the invention comprise at least one block copolymer comprising at least two A blocks and at least one B block. The A and B blocks are derived from monoethylenically unsaturated monomers, which monomers result in saturated polymer backbones without the need for subsequent hydrogenation upon their polymerization. Preferably, the block copolymer is a (meth)acrylate block copolymer.

Abstract: A method for aqueous bead-type suspension polymerization of (meth)acrylic monomers to prepare non-agglomerating, storage stable (meth)acrylic polymer beads which are extrudable at low temperatures. The invention also relates to the polymer beads and to their use as adhesive, in particular as a pressure sensitive adhesive. The invention also discloses adhesive compositions comprising the polymer beads.